PIC18F25J11-I/SS Microchip Technology, PIC18F25J11-I/SS Datasheet - Page 353

IC PIC MCU FLASH 32K 2V 28-SSOP

PIC18F25J11-I/SS

Manufacturer Part Number
PIC18F25J11-I/SS
Description
IC PIC MCU FLASH 32K 2V 28-SSOP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets

Specifications of PIC18F25J11-I/SS

Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Core Processor
PIC
Speed
48MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Program Memory Type
FLASH
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2.15 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
Controller Family/series
PIC18
No. Of I/o's
16
Ram Memory Size
3.6875KB
Cpu Speed
48MHz
No. Of Timers
5
Interface
EUSART, I2C, SPI
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3776 B
Interface Type
EUSART, I2C, SPI
Maximum Clock Frequency
48 MHz
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM183022, DM183032, DV164136, MA180023
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
20.7
The A/D Converter in the PIC18F46J11 family of
devices includes a self-calibration feature, which com-
pensates for any offset generated within the module.
The calibration process is automated and is initiated by
setting the ADCAL bit (ADCON1<6>). The next time
the GO/DONE bit is set, the module will perform a
“dummy” conversion (that is, with reading none of the
input channels) and store the resulting value internally
to compensate for the offset. Thus, subsequent offsets
will be compensated.
Example 20-1 provides an example of a calibration
routine.
The calibration process assumes that the device is in a
relatively steady-state operating condition. If A/D
calibration is used, it should be performed after each
device Reset or if there are other major changes in
operating conditions.
20.8
The selection of the automatic acquisition time and A/D
conversion clock is determined in part by the clock
source and frequency while in a power-managed
mode.
EXAMPLE 20-1:
© 2009 Microchip Technology Inc.
CALIBRATION
A/D Converter Calibration
Operation in Power-Managed
Modes
BCF
BSF
BSF
BSF
BTFSC
BRA
BCF
ANCON0,PCFG0
ADCON0,ADON
ADCON1,ADCAL
ADCON0,GO
ADCON0,GO
CALIBRATION
ADCON1,ADCAL
SAMPLE A/D CALIBRATION ROUTINE
;Make Channel 0 analog
;Enable A/D module
;Enable Calibration
;Start a dummy A/D conversion
;
;Wait for the dummy conversion to finish
;
;Calibration done, turn off calibration enable
;Proceed with the actual A/D conversion
PIC18F46J11 FAMILY
If the A/D is expected to operate while the device is in
a power-managed mode, the ACQT<2:0> and
ADCS<2:0> bits in ADCON1 should be updated in
accordance with the power-managed mode clock that
will be used. After the power-managed mode is entered
(either of the power-managed Run modes), an A/D
acquisition or conversion may be started. Once an
acquisition or conversion is started, the device should
continue to be clocked by the same power-managed
mode clock source until the conversion has been com-
pleted. If desired, the device may be placed into the
corresponding power-managed Idle mode during the
conversion.
If the power-managed mode clock frequency is less
than 1 MHz, the A/D RC clock source should be
selected.
Operation in the Sleep mode requires the A/D RC clock
to be selected. If bits, ACQT<2:0>, are set to ‘000’ and
a conversion is started, the conversion will be delayed
one instruction cycle to allow execution of the SLEEP
instruction and entry to Sleep mode. The IDLEN and
SCS bits in the OSCCON register must have already
been cleared prior to starting the conversion.
DS39932C-page 353

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