DSPIC33FJ12MC202-I/ML Microchip Technology, DSPIC33FJ12MC202-I/ML Datasheet - Page 259

• Manufacturer Part Number: DSPIC33FJ12MC202-I/ML
• Description: IC DSPIC MCU/DSP 12K 28QFN
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ12MC202-I/ML

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 12KB (12K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Core Frequency: 40MHz
• Core Supply Voltage: 2.75V
• Embedded Interface Type: I2C, JTAG, SPI, UART
• No. Of I/o's: 21
• Flash Memory Size: 12KB
• Supply Voltage Range: 3V To 3.6V
• Package: 28QFN EP
• Device Core: dsPIC
• Family Name: dSPIC33
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 3.3 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 21
• Interface Type: I2C/SPI/UART
• On-chip Adc: 6-chx10-bit|6-chx12-bit
• Number Of Timers: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164336 - MODULE SOCKET FOR PM3 28/44QFNDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

24.2
© 2008 Microchip Technology Inc.
20-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
NOTE 1
A
A1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Package Details
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
N
1
2
b
b1
3
D
Dimension Limits
Preliminary
dsPIC33FJ12MC201/202
e
Units
A2
A1
E1
eB
b1
N
D
e
A
E
b
L
c
A2
E1
.015
.300
.240
.980
.008
.045
.014
MIN
.115
.115
–
–
L
.100 BSC
INCHES
1.030
NOM
.130
.310
.250
.130
.010
.060
.018
20
–
–
–
Microchip Technology Drawing C04-019B
1.060
MAX
.210
.195
.325
.280
.150
.015
.070
.022
.430
–
eB
E
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