DSPIC33FJ64GS606T-I/PT Microchip Technology, DSPIC33FJ64GS606T-I/PT Datasheet - Page 406

MCU/DSP 16BIT 64KB FLASH 64TQFP

DSPIC33FJ64GS606T-I/PT

Manufacturer Part Number
DSPIC33FJ64GS606T-I/PT
Description
MCU/DSP 16BIT 64KB FLASH 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet

Specifications of DSPIC33FJ64GS606T-I/PT

Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
64-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, QEI, POR, PWM, WDT
Number Of I /o
58
Ram Size
9K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Numeric And Arithmetic Format
Fixed-Point or Floating-Point
Instruction Set Architecture
Harvard
Device Million Instructions Per Second
40 MIPs
Maximum Clock Frequency
120 MHz
Number Of Programmable I/os
58
Data Ram Size
4 KB
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Interface Type
I2C, SPI, UART
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
On-chip Dac
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33FJ64GS606T-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
TABLE B-1:
DS70591C-page 406
Section 27.0 “Electrical
Characteristics”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Updated the Absolute Maximum Ratings for high temperature and added
Note 4.
Updated all Operating Current (I
Updated all Idle Current (I
Updated all Power-Down Current (I
Table 27-7.
Updated all Doze Current (I
Updated the Typ and Max values for parameter D150 and removed
parameters DI26, DI28, and DI29 from the I/O Pin Input Specifications
(see Table 27-9).
Updated the Typ and Max values for parameter DO10 and DO27 and the
Min and Typ values for parameter DO20 in the I/O Pin Output
Specifications (see Table 27-10).
Added parameter numbers to the Auxiliary PLL Clock Timing
Specifications (see Table 27-18).
Added parameters numbers and updated the Internal RC Accuracy Min,
Typ, and Max values (see Table 27-19 and Table 27-20).
Added parameter numbers, Note 2, updated the Min and Typ parameter
values for MP31 and MP32, and removed the conditions for MP10 and
MP11 in the High-Speed PWM Module Timing Requirements (see
Table 27-29).
Updated the SPIx Module Slave Mode (CKE = 1) Timing Characteristics
(see Figure 27-14).
Added parameter IM51 to the I2Cx Bus Data Timing Requirements
(Master Mode) (see Table 27-34).
Updated the Max value for parameter AD33 in the 10-bit High-Speed A/D
Module Specifications (see Table 27-36).
Updated the titles and added parameter numbers to the Comparator and
DAC Module Specifications (see Table 27-38 and Table 27-39) and the
DAC Output Buffer Specifications (see Table 27-40).
Preliminary
IDLE
Update Description
DOZE
) Typical and Max values in Table 27-6.
DD
) Typical and Max values in Table 27-8.
) Typical and Max values in Table 27-5.
PD
) Typical and Max values in
 2010 Microchip Technology Inc.

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