PIC18F2480-I/SP Microchip Technology, PIC18F2480-I/SP Datasheet - Page 6

• Manufacturer Part Number: PIC18F2480-I/SP
• Description: IC PIC MCU FLASH 8KX16 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2480-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 16KB (8K x 16)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 25
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: SPI/I2C/MSSP/EUSART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Operating Supply Voltage: 5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163011, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Height: 3.3 mm
• Length: 34.67 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Width: 7.24 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F2480/2580/4480/4580
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Interrupts .................................................................................................................................................................................. 119
11.0 I/O Ports ................................................................................................................................................................................... 135
12.0 Timer0 Module ......................................................................................................................................................................... 151
13.0 Timer1 Module ......................................................................................................................................................................... 155
14.0 Timer2 Module ......................................................................................................................................................................... 161
15.0 Timer3 Module ......................................................................................................................................................................... 163
16.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 167
17.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 177
18.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 191
19.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART) ....................................................................................... 231
20.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 253
21.0 Comparator Module.................................................................................................................................................................. 263
22.0 Comparator Voltage Reference Module ................................................................................................................................... 269
23.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 273
24.0 ECAN Module........................................................................................................................................................................... 279
25.0 Special Features of the CPU .................................................................................................................................................... 349
26.0 Instruction Set Summary .......................................................................................................................................................... 367
27.0 Development Support............................................................................................................................................................... 417
28.0 Electrical Characteristics .......................................................................................................................................................... 421
29.0 Packaging Information.............................................................................................................................................................. 459
Appendix A: Revision History............................................................................................................................................................. 471
Appendix B: Device Differences......................................................................................................................................................... 471
Appendix C: Conversion Considerations ........................................................................................................................................... 472
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 472
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 473
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 473
The Microchip Web Site ..................................................................................................................................................................... 487
Customer Change Notification Service .............................................................................................................................................. 487
Customer Support .............................................................................................................................................................................. 487
Reader Response .............................................................................................................................................................................. 488
PIC18F2480/2580/4480/4580 Product Identification System ............................................................................................................ 489
DS39637D-page 6
Device Overview .......................................................................................................................................................................... 9
Guidelines for Getting Started with PIC18F Microcontrollers ..................................................................................................... 25
Oscillator Configurations ............................................................................................................................................................ 29
Power-Managed Modes ............................................................................................................................................................. 39
Reset .......................................................................................................................................................................................... 47
Memory Organization ................................................................................................................................................................. 67
Flash Program Memory ............................................................................................................................................................ 101
Data EEPROM Memory ........................................................................................................................................................... 111
8 x 8 Hardware Multiplier.......................................................................................................................................................... 117
© 2009 Microchip Technology Inc.