MC9S08QE4CTGR Freescale Semiconductor, MC9S08QE4CTGR Datasheet - Page 3

• Manufacturer Part Number: MC9S08QE4CTGR
• Description: MCU 8BIT 4K FLASH 16-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QE4CTGR

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number Of I /o: 12
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

1
The block diagram,
Freescale Semiconductor
V
V
V
V
SS
DD
SSA
DDA
Notes: When PTA5 is configured as RESET, pin becomes bi-directional with output being open-drain drive containing an internal pullup device.
/V
/V
REFL
REFH
pins not available on 16-pin packages
pins not available on 16-pin or 20-pin packages
pins not available on 16-pin, 20-pin or 28-pin packages
(MC9S08QE8 = 8192 BYTES)
(MC9S08QE4 = 4096 BYTES)
When PTA4 is configured as BKGD, pin becomes bi-directional.
For the 16-pin and 20-pin packages, V
COP
(MC9S08QE8 = 512 BYTES)
(MC9S08QE4 = 256 BYTES)
LOW-POWER OSCILLATOR
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
20 MHz INTERNAL CLOCK
MODES OF OPERATION
VOLTAGE REGULATOR
POWER MANAGEMENT
CPU
MCU Block Diagram
31.25 kHz to 38.4 kHz
1 MHz to 16 MHz
SOURCE (ICS)
HCS08 CORE
USER FLASH
USER RAM
(XOSCVLP)
IRQ
V
V
REFL
REFH
Figure
BDC
LVD
1, shows the structure of MC9S08QE8 series MCU.
XTAL
IRQ
EXTAL
SSA
Figure 1. MC9S08QE8 Series Block Diagram
BKGD/MS
/V
REFL
MC9S08QE8 Series Data Sheet, Rev. 8
V
V
V
V
SSA
DDA
SSA
DDA
and V
SERIAL COMMUNICATIONS
DDA
INTERFACE MODULE (SCI)
INTERFACE MODULE (SPI)
ANALOG COMPARATOR
ANALOG COMPARATOR
DEBUG MODULE (DBG)
KEYBOARD INTERRUPT
REAL-TIME COUNTER
CONVERTER (ADC12)
SERIAL PERIPHERAL
ANALOG-TO-DIGITAL
/V
16-BIT TIMER PWM
16-BIT TIMER PWM
REFH
IIC MODULE (IIC)
MODULE (TPM1)
MODULE (TPM2)
MODULE (KBI)
(ACMP1)
(ACMP2)
are double bonded to V
12-BIT
(RTC)
SS
SCL
SDA
RxD
TxD
SS
MISO
MOSI
SPSCK
TCLK
TPM1CH0
TPM1CH1
TPM1CH2
TCLK
TPM2CH0
TPM2CH1
TPM2CH2
ACMP1O
ACMP1–
ACMP1+
ACMP2O
ACMP2–
ACMP2+
ADP9–ADP0
KBIP7–KBIP0
and V
DD
respectively.
PTA7/TPM2CH2/ADP9
PTA6/TPM1CH2/ADP8
PTA5/IRQ/TCLK/RESET
PTA4/ACMP1O/BKGD/MS
PTA3/KBIP3/SCL/ADP3
PTA2/KBIP2/SDA/ADP2
PTA1/KBIP1/TPM2CH0/ADP1/ACMP1–
PTA0/KBIP0/TPM1CH0/ADP0/ACMP1+
PTB7/SCL/EXTAL
PTB6/SDA/XTAL
PTB5/TPM1CH1/SS
PTB4/TPM2CH1/MISO
PTB3/KBIP7/MOSI/ADP7
PTB2/KBIP6/SPSCK/ADP6
PTB1/KBIP5/TxD/ADP5
PTB0/KBIP4/RxD/ADP4
PTC7/ACMP2–
PTC6/ACMP2+
PTC5/ACMP2O
PTC4
PTC3
PTC2
PTC1/TPM2CH2
PTC0/TPM1CH2
PTD3
PTD2
PTD1
PTD0
MCU Block Diagram
3