MC9S08JM16CLD Freescale Semiconductor, MC9S08JM16CLD Datasheet - Page 18

• Manufacturer Part Number: MC9S08JM16CLD
• Description: MCU 8BIT 16K FLASH 44-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08JM16CLD

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, LIN, SCI, SPI, USB
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 33
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-LQFP
• Processor Series: S08JM
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: I2C, SPI
• Maximum Clock Frequency: 48 MHz
• Number Of Programmable I/os: 33
• Number Of Timers: 2
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMOJM, DEMOJMSKT, DEMOFLEXISJMSD, DEMO9S08JM16
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 8 Channel
• Controller Family/series: HCS08
• No. Of I/o's: 33
• Ram Memory Size: 1KB
• Cpu Speed: 48MHz
• No. Of Timers: 2
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

18.4 Register Definition ........................................................................................................................341
A.1 Introduction ....................................................................................................................................349
A.2 Parameter Classification.................................................................................................................349
A.3 Absolute Maximum Ratings...........................................................................................................349
A.4 Thermal Characteristics..................................................................................................................350
A.5 ESD Protection and Latch-up Immunity........................................................................................351
A.6 DC Characteristics..........................................................................................................................352
A.7 Supply Current Characteristics.......................................................................................................356
A.8 Analog Comparator (ACMP) Electricals .......................................................................................357
A.9 ADC Characteristics.......................................................................................................................357
A.10 External Oscillator (XOSC) Characteristics ..................................................................................361
A.11 MCG Specifications .......................................................................................................................362
A.12 AC Characteristics..........................................................................................................................363
A.13 Flash Specifications........................................................................................................................369
A.14 USB Electricals ..............................................................................................................................369
18.5 EMC Performance .........................................................................................................................370
B.1 Ordering Information .....................................................................................................................373
B.2 Orderable Part Numbering System ................................................................................................373
B.3 Mechanical Drawings.....................................................................................................................373
18
18.4.1 BDC Registers and Control Bits .....................................................................................341
18.4.2 System Background Debug Force Reset Register (SBDFR) ..........................................343
18.4.3 DBG Registers and Control Bits .....................................................................................344
A.12.1 Control Timing ................................................................................................................363
A.12.2 Timer/PWM (TPM) Module Timing ...............................................................................364
A.12.3 SPI Characteristics ...........................................................................................................365
18.5.1 Radiated Emissions .........................................................................................................370
Ordering Information and Mechanical Drawings
Electrical Characteristics
MC9S08JM16 Series Data Sheet, Rev. 2
Appendix A
Appendix B
Freescale Semiconductor