MC9S08GT16ACFBE Freescale Semiconductor, MC9S08GT16ACFBE Datasheet - Page 154

• Manufacturer Part Number: MC9S08GT16ACFBE
• Description: IC MCU 16K FLASH 2K RAM 44-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08GT16ACFBE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 2KB
• # I/os (max): 36
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: PQFP
• Processor Series: S08GT
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 36
• Operating Supply Voltage: 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: M68EVB908GB60E, M68DEMO908GB60E
• Minimum Operating Temperature: - 40 C
• For Use With: M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Timer/PWM (S08TPMV2)
154
NOTES 2, 3
NOTE 4
RESET
NOTES:
V
V
V
DD
SS
SS
IRQ
1. Port pins are software configurable with pullup device if input port.
2. Pin contains pullup/pulldown device if IRQ enabled (IRQPE = 1).
3. IRQ does not have a clamp diode to VDD. IRQ should not be driven above VDD.
4. Pin contains integrated pullup device.
5. High current drive
6. Pins PTA[7:4] contain both pullup and pulldown devices. Pulldown available when KBI enabled (KBIPn = 1).
HCS08 SYSTEM CONTROL
LOW-POWER OSCILLATOR
RESETS AND INTERRUPTS
MODES OF OPERATION
CPU
POWER MANAGEMENT
IRQ
RTI
(GT16A = 16,384 BYTES)
GENERATOR (ICG)
(GT16A = 2048 BYTES)
INTERNAL CLOCK
(GT8A = 1024 BYTES)
(GT8A = 8192 BYTES)
MODULE (DBG)
ON-CHIP ICE
USER FLASH
REGULATOR
HCS08 CORE
USER RAM
VOLTAGE
DEBUG
Figure 10-1. Block Diagram Highlighting the TPM Modules
BDC
COP
LVD
MC9S08GT16A/GT8A Data Sheet, Rev. 1
BKGD
= Pins not available in 44-, 42-, or 32-pin packages
= Pins not available in 42- or 32-pin packages
= Pins not available in 32-pin packages
SERIAL COMMUNICATIONS
SERIAL COMMUNICATIONS
2-CHANNEL TIMER/PWM
3-CHANNEL TIMER/PWM
ANALOG-TO-DIGITAL
SERIAL PERIPHERAL
CONVERTER (ATD)
INTERFACE (SCI2)
INTERFACE (SCI1)
8-BIT KEYBOARD
INTERRUPT (KBI)
INTERFACE (SPI)
INTER-IC (IIC)
(TPM2)
10-BIT
(TPM1)
EXTAL
BKGD
XTAL
8
8
SPSCK
RXD2
TXD2
MOSI
MISO
RXD1
TXD1
SCL
SDA
CH1
CH0
CH0
CH1
CH2
SS
4
4
4
4
Freescale Semiconductor
PTA7/KBIP7–
PTA4/KBIP4
PTA3/KBIP3–
PTA0/KBIP0
PTC7
PTC6
PTC5
PTC4
PTC3/SCL
PTC2/SDA
PTC1/RxD2
PTC0/TxD2
PTD4/TPM2CH1
PTD3/TPM2CLK/TPM2CH0
PTD2/TPM1CH2
PTD1/TPM1CH1
PTD0/TPM1CLK/TPM1CH0
PTE5/SPSCK
PTE4/MOSI
PTE3/MISO
PTE2/SS
PTE1/RxD1
PTE0/TxD1
PTB7/ADP7–
PTB4/ADP4
PTB3/ADP3–
PTB0/ADP0
PTG3
PTG2/EXTAL
PTG1/XTAL
PTG0/BKGD/MS
NOTE 6
NOTE 5