M38227ECFP Renesas Electronics America, M38227ECFP Datasheet - Page 10

• Manufacturer Part Number: M38227ECFP
• Description: IC 740 MCU EPROM 48K 80QFP
• Manufacturer: Renesas Electronics America
• Series: 740/38000r

Specifications of M38227ECFP

• Core Processor: 740
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SIO, UART/USART
• Peripherals: LCD
• Number Of I /o: 49
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: OTP
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 80-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Currently products are listed below.
Fig. 5 Memory expansion plan
Table 3 List of products
GROUP EXPANSION (STANDARD, ONE TIME
PROM VERSION, EPROM VERSION)
Mitsubishi plans to expand the 3822 group (Standard, One Time
PROM version, EPROM version) as follows:
Memory Type
Support for Mask ROM, One Time PROM, and EPROM versions
M38222M2-XXXFP
M38222M2-XXXGP
M38222M2-XXXHP
M38223M4-XXXFP
M38223E4FP
M38223M4-XXXGP
M38223E4GP
M38223M4-XXXHP
M38223E4HP
M38223E4FS
M38227ECFP
M38227ECHP
M38227ECFS
Memory Expansion Plan
Product
ROM size (bytes)
Note: Products under development or planning: the development schedule and specifications
3 2 K
2 8 K
2 4 K
2 0 K
1 6 K
1 2 K
4 8 K
ROM size for User in (
8 K
4 K
ROM size (bytes)
may be revised without notice.
(16254)
(49022)
(8062)
16384
49152
8192
1 9 2
M a s s p r o d u c t
)
2 5 6
RAM size (bytes)
M a s s p r o d u c t
M 3 8 2 2 2 M 2
1024
384
384
512
R A M s i z e ( b y t e s )
M 3 8 2 2 3 M 4 / E 4
512
Memory Size
ROM size ............................................................. 8 K to 48 K bytes
RAM size ............................................................ 384 to 1024 bytes
Package
80P6N-A .................................... 0.8 mm-pitch plastic molded QFP
80P6S-A .................................. 0.65 mm-pitch plastic molded QFP
80P6Q-A .................................... 0.5 mm-pitch plastic molded QFP
80D0 ....................... 0.8 mm-pitch ceramic LCC (EPROM version)
Package
80P6N-A
80P6Q-A
80P6N-A
80P6S-A
80P6Q-A
80P6Q-A
80P6S-A
80P6N-A
80D0
80D0
6 4 0
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
Mask ROM version
Mask ROM version
Mask ROM version
Mask ROM version
One Time PROM version (blank)
Mask ROM version
One Time PROM version (blank)
Mask ROM version
One Time PROM version (blank)
EPROM version
One Time PROM version (blank)
One Time PROM version (blank)
EPROM version
7 6 8
Under development
MITSUBISHI MICROCOMPUTERS
8 9 6
M 3 8 2 2 7 E C
Remarks
1 0 2 4
3822 Group
As of Feb. 2002
7