MCF52259CAG80 Freescale Semiconductor, MCF52259CAG80 Datasheet - Page 28

• Manufacturer Part Number: MCF52259CAG80
• Description: MCU 32BIT COLDFIRE V2 144LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCF5225xr

Specifications of MCF52259CAG80

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, QSPI, UART/USART, USB OTG
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 96
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: MCF522x
• Core: ColdFire V2
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: I2C/QSPI/UART
• Maximum Clock Frequency: 80 MHz
• Number Of Programmable I/os: 96
• Number Of Timers: 10
• Operating Supply Voltage: - 0.3 V to + 4 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: TWR-MCF5225X, TWR-SENSOR-PAK, TWR-SER, TWR-ELEV, TOWER, M52259EVB, M52259DEMOKIT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 12-bit
• For Use With: M52259DEMOKIT - BOARD KIT DEMO MCF5225X LOW COSTM52259EVB - BOARD EVAL FOR 52259 COLDFIRE V2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

2.4
The flash memory characteristics are shown in
Freescale Semiconductor
1
2
System clock (read only)
System clock (program/erase)
16
17
18
The average chip-junction temperature (T
Where:
For most applications P
Solving equations 1 and 2 for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring P
for a known T
any value of T
Refer to the flash memory section for more information
Depending on packaging; see the orderable part number summary.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
1
Maximum number of guaranteed program/erase cycles
Data retention at average operating temperature of 85C
A program/erase cycle is defined as switching the bits from 1  0  1.
Flash Memory Characteristics
T

P
P
P
A
D
INT
I/O
JA
A
A
. Using this value of K, the values of P
.
Parameter
= ambient temperature, C
= package thermal resistance, junction-to-ambient, C/W
= P
= chip internal power, I
= power dissipation on input and output pins — user determined, watts
I/O
INT
 P
Table 9. SGFM Flash Program and Erase Characteristics
P
INT
K = P
2
Table 10. SGFM Flash Module Life Characteristics
I/O
and can be ignored. An approximate relationship between P
Parameter
D
 (T
MCF52259 ColdFire Microcontroller, Rev. 4
J
A
) in C can be obtained from:
+ 273 C) + 
P
DD
T
Table 9
D
J
 V
=
=
K
T
DD
(V
(V
A
D

and
DD
DD
+
, watts
and T
Symbol

f
sys(P/E)
f
T

sys(R)
P
J
= 3.0 to 3.6 V)
= 3.0 to 3.6 V)
JMA
1
Table
+
D
before failure
J
273C

can be obtained by solving equations (1) and (2) iteratively for
 P

JMA
10.
D

2

(1)
(2)
(3)
0.15
Min
0
Retention
Symbol
P/E
Typ
—
—
D
and T
Electrical Characteristics
66.67 or 80
66.67 or 80
10,000
J
Value
(if P
10
Max
I/O
2
D
is neglected) is:
(at equilibrium)
1
1
Cycles
Years
Unit
MHz
MHz
Unit
28