SAF-XE164H-72F66L AC Infineon Technologies, SAF-XE164H-72F66L AC Datasheet - Page 79

• Manufacturer Part Number: SAF-XE164H-72F66L AC
• Description: IC MCU 16BIT FLASH 100-LQFP
• Manufacturer: Infineon Technologies
• Series: XE16xr

Specifications of SAF-XE164H-72F66L AC

• Core Processor: C166SV2
• Core Size: 16-Bit
• Speed: 66MHz
• Connectivity: EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
• Peripherals: I²S, POR, PWM, WDT
• Number Of I /o: 75
• Program Memory Size: 576KB (576K x 8)
• Program Memory Type: FLASH
• Ram Size: 50K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LFQFP
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN
• Maximum Clock Frequency: 16.5 MHz
• Number Of Programmable I/os: 75
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: SP000363779; SP000363780

4.2.3
The power consumed by the XE164 depends on several factors such as supply voltage,
operating frequency, active circuits, and operating temperature. The power consumption
specified here consists of two components:
•
•
To determine the actual power consumption, always both components, switching current
I
I
Note: The power consumption values are not subject to production test. They are
The given power consumption parameters and their values refer to specific operating
conditions:
•
•
Note: The maximum values cover the complete specified operating range of all
For additional information, please refer to
Data Sheet
S
DDP
(Table
The switching current
The leakage current
Active mode:
Regular operation, i.e. peripherals are active, code execution out of Flash.
Stopover mode:
Crystal oscillator and PLL stopped, Flash switched off, clock in domain DMP_1
stopped.
=
verified by design/characterization.
To determine the total power consumption for dimensioning the external power
supply, also the pad driver currents must be considered.
manufactured devices.
The typical values refer to average devices under typical conditions, such as
nominal supply voltage, room temperature, application-oriented activity.
After a power reset, the decoupling capacitors for
maximum possible current, see parameter
I
S
+
16) and leakage current
I
Power Consumption
LK
.
I
LK
I
S
depends on the device temperature
depends on the device activity
I
LK
(Table
Section
77
17) must be added:
I
CC
5.2,
in
Thermal
Table
XE166 Family Derivatives
V
DDI
20.
Electrical Parameters
Considerations.
are charged with the
V2.1, 2008-08
XE164x