C8051F122 Silicon Laboratories Inc, C8051F122 Datasheet - Page 190

• Manufacturer Part Number: C8051F122
• Description: IC 8051 MCU FLASH 128K 100TQFP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F12xr

Specifications of C8051F122

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 100MHz
• Connectivity: EBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 64
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8.25K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x8b, 8x10b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

C8051F120/1/2/3/4/5/6/7
C8051F130/1/2/3
14.4. External Crystal Example
If a crystal or ceramic resonator is used as an external oscillator source for the MCU, the circuit should be
configured as shown in Figure 14.1, Option 1. The External Oscillator Frequency Control value (XFCN)
should be chosen from the Crystal column of the table in SFR Definition 14.4 (OSCXCN register). For
example, an 11.0592 MHz crystal requires an XFCN setting of 111b.
When the crystal oscillator is enabled, the oscillator amplitude detection circuit requires a settle time to
achieve proper bias. Waiting at least 1 ms between enabling the oscillator and checking the XTLVLD bit
will prevent a premature switch to the external oscillator as the system clock. Switching to the external
oscillator before the crystal oscillator has stabilized can result in unpredictable behavior. The recom-
mended procedure is:
Important Note on External Crystals: Crystal oscillator circuits are quite sensitive to PCB layout. The
crystal should be placed as close as possible to the XTAL pins on the device. The traces should be as
short as possible and shielded with ground plane from any other traces which could introduce noise or
interference.
14.5. External RC Example
If an RC network is used as an external oscillator source for the MCU, the circuit should be configured as
shown in Figure 14.1, Option 2. The capacitor should be no greater than 100 pF; however for very small
capacitors, the total capacitance may be dominated by parasitic capacitance in the PCB layout. To deter-
mine the required External Oscillator Frequency Control value (XFCN) in the OSCXCN Register, first
select the RC network value to produce the desired frequency of oscillation. If the frequency desired is
100 kHz, let R = 246 k  and C = 50 pF:
f = 1.23(10
Referring to the table in SFR Definition 14.4, the required XFCN setting is 010.
14.6. External Capacitor Example
If a capacitor is used as an external oscillator for the MCU, the circuit should be configured as shown in
Figure 14.1, Option 3. The capacitor should be no greater than 100 pF; however for very small capacitors,
the total capacitance may be dominated by parasitic capacitance in the PCB layout. To determine the
required External Oscillator Frequency Control value (XFCN) in the OSCXCN Register, select the capaci-
tor to be used and find the frequency of oscillation from the equations below. Assume V
C = 50 pF:
f = KF/( C x V
f = KF/150
If a frequency of roughly 50 kHz is desired, select the K Factor from the table in SFR Definition 14.4
as KF = 7.7:
f = 7.7/150 = 0.051 MHz, or 51 kHz
Therefore, the XFCN value to use in this example is 010.
190
Step 1. Enable the external oscillator.
Step 2. Wait at least 1 ms.
Step 3. Poll for XTLVLD => ‘1’.
Step 4. Switch the system clock to the external oscillator.
3
)/RC = 1.23 (10
DD
) = KF/( 50 x 3 )
3
)/[246 x 50] = 0.1 MHz = 100 kHz
Rev. 1.4
DD
= 3.0 V and