MC9S08RD32CFJE Freescale Semiconductor, MC9S08RD32CFJE Datasheet - Page 47

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MC9S08RD32CFJE

Manufacturer Part Number
MC9S08RD32CFJE
Description
IC MCU 32K FLASH 8MHZ 32-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08RD32CFJE

Core Processor
HCS08
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08RD32CFJE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
4.4.6
Block protection prevents program or erase changes for FLASH memory locations in a designated address
range. Mass erase is disabled when any block of FLASH is protected. The MC9S08RC/RD/RE/RG allows
a block of memory at the end of FLASH, and/or the entire FLASH memory to be block protected. A
disable control bit and a 3-bit control field, for each of the blocks, allows the user to independently set the
size of these blocks. A separate control bit allows block protection of the entire FLASH memory array. All
seven of these control bits are located in the FPROT register (see
Register (FPROT and
At reset, the high-page register (FPROT) is loaded with the contents of the NVPROT location that is in the
nonvolatile register block of the FLASH memory. The value in FPROT cannot be changed directly from
application software so a runaway program cannot alter the block protection settings. If the last 512 bytes
of FLASH (which includes the NVPROT register) is protected, the application program cannot alter the
block protection settings (intentionally or unintentionally). The FPROT control bits can be written by
background debug commands to allow a way to erase a protected FLASH memory.
One use for block protection is to block protect an area of FLASH memory for a bootloader program. This
bootloader program then can be used to erase the rest of the FLASH memory and reprogram it. Because
the bootloader is protected, it remains intact even if MCU power is lost during an erase and reprogram
operation.
Freescale Semiconductor
Writing to a FLASH address before the internal FLASH clock frequency has been set by writing
to the FCDIV register
command buffer is empty.)
Writing a second time to a FLASH address before launching the previous command (There is only
one write to FLASH for every command.)
Writing a second time to FCMD before launching the previous command (There is only one write
to FCMD for every command.)
Writing to any FLASH control register other than FCMD after writing to a FLASH address
Writing any command code other than the five allowed codes ($05, $20, $25, $40, or $41) to
FCMD
Accessing (read or write) any FLASH control register other than the write to FSTAT (to clear
FCBEF and launch the command) after writing the command to FCMD
The MCU enters stop mode while a program or erase command is in progress (The command is
aborted.)
Writing the byte program, burst program, or page erase command code ($20, $25, or $40) with a
background debug command while the MCU is secured (The background debug controller can
only do blank check and mass erase commands when the MCU is secure.)
Writing 0 to FCBEF to cancel a partial command
Writing to a FLASH address while FCBEF is not set (A new command cannot be started until the
FLASH Block Protection
NVPROT)“).
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
Section 4.6.4, “FLASH Protection
Memory
47

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