AD8279ARZ Analog Devices Inc, AD8279ARZ Datasheet - Page 7

• Manufacturer Part Number: AD8279ARZ
• Description: IC AMP DIFF LP 14SOIC
• Manufacturer: Analog Devices Inc

Specifications of AD8279ARZ

• Amplifier Type: Differential
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 1.4 V/µs
• Gain Bandwidth Product: 1MHz
• Voltage - Input Offset: 50µV
• Current - Supply: 300µA
• Current - Output / Channel: 15mA
• Voltage - Supply, Single/dual (±): 2 V ~ 36 V, ±2 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• No. Of Amplifiers: 2
• Input Offset Voltage: 500µV
• Bandwidth: 1MHz
• Supply Voltage Range: 2V To 36V
• Supply Current: 200µA
• Amplifier Case Style: SOIC
• No. Of Pins: 14
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Current - Input Bias: -

ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Supply Voltage
Maximum Voltage at Any Input Pin
Minimum Voltage at Any Input Pin
Storage Temperature Range
Specified Temperature Range
Package Glass Transition Temperature (T
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The θ
board with zero airflow.
Table 7. Thermal Resistance
Package Type
8-Lead MSOP
8-Lead SOIC
14-Lead SOIC
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8278 and
AD8279 are limited by the associated rise in junction tempera-
ture (T
transition temperature, the properties of the plastic change.
Even temporarily exceeding this temperature limit may change
the stresses that the package exerts on the die, permanently shifting
the parametric performance of the amplifiers. Exceeding a
temperature of 150°C for an extended period may result in a
loss of functionality.
JA
J
) on the die. At approximately 150°C, which is the glass
values in Table 7 assume a 4-layer JEDEC standard
θ
135
121
105
JA
G
)
Unit
°C/W
°C/W
°C/W
Rating
±18 V
−V
+V
−65°C to +150°C
−40°C to +85°C
150°C
S
S
+ 40 V
− 40 V
Rev. C | Page 7 of 24
SHORT-CIRCUIT CURRENT
The AD8278 and AD8279 have built-in, short-circuit protection
that limits the output current (see Figure 29 for more information).
While the short-circuit condition itself does not damage the
part, the heat generated by the condition can cause the part to
exceed its maximum junction temperature, with corresponding
negative effects on reliability. Figure 3 and Figure 29, combined
with knowledge of the supply voltages and ambient temperature of
the part, can be used to determine whether a short circuit will
cause the part to exceed its maximum junction temperature.
ESD CAUTION
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
2.0
1.6
1.2
0.8
0.4
0
–50
–25
θ
JA
MSOP
= 135°C/W
0
AMBIENT TEMERATURE (°C)
θ
JA
25
= 121°C/W
SOIC
50
AD8278/AD8279
T
J
75
MAX = 150°C
100
125