LT1206CR Linear Technology, LT1206CR Datasheet - Page 12

• Manufacturer Part Number: LT1206CR
• Description: IC CURRNT FEEDBCK AMP 250MA 7-DD
• Manufacturer: Linear Technology

Specifications of LT1206CR

• Amplifier Type: Current Feedback
• Number Of Circuits: 1
• Slew Rate: 900 V/µs
• -3db Bandwidth: 60MHz
• Current - Input Bias: 10µA
• Voltage - Input Offset: 3000µV
• Current - Supply: 20mA
• Current - Output / Channel: 1.2A
• Voltage - Supply, Single/dual (±): 10 V ~ 30 V, ±5 V ~ 15 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: TO-263-7, D²Pak (7 leads + Tab), TO-263CA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Output Type: -
• Gain Bandwidth Product: -

applicaTions inForMaTion
LT1206
power plane layer either inside or on the opposite side of
the board. Although the actual thermal resistance of the
PCB material is high, the length/area ratio of the thermal
resistance between the layer is small. Copper board stiffen-
ers and plated through holes can also be used to spread
the heat generated by the device.
Tables 1 and 2 list thermal resistance for each package.
For the TO-220 package, thermal resistance is given for
junction-to-case only since this package is usually mounted
to a heat sink. Measured values of thermal resistance for
several different board sizes and copper areas are listed
for each surface mount package. All measurements were
taken in still air on 3/32" FR-4 board with 1oz copper. This
data can be used as a rough guideline in estimating thermal
resistance. The thermal resistance for each application will
be affected by thermal interactions with other components
as well as board size and shape.
*Tab of device attached to topside copper.
*Pins 1 and 8 attached to topside copper.
Y Package, 7-Lead TO-220
Thermal Resistance (Junction-to-Case) = 5°C/W
N8 Package, 8-Lead DIP
Thermal Resistance (Junction-to-Ambient) = 100°C/W
2500 sq. mm 2500 sq. mm 2500 sq. mm
1000 sq. mm 2500 sq. mm 2500 sq. mm
2500 sq. mm 2500 sq. mm 2500 sq. mm
1000 sq. mm 2500 sq. mm 2500 sq. mm
12
Table 1. R Package, 7-Lead DD
Table 2. S8 Package, 8-Lead Plastic SO
125 sq. mm 2500 sq. mm 2500 sq. mm
225 sq. mm 2500 sq. mm 2500 sq. mm
100 sq. mm 2500 sq. mm 2500 sq. mm
100 sq. mm 1000 sq. mm 2500 sq. mm
100 sq. mm 225 sq. mm 2500 sq. mm
100 sq. mm 100 sq. mm 2500 sq. mm
TOPSIDE*
TOPSIDE*
COPPER AREA
COPPER AREA
BACKSIDE
BACKSIDE
BOARD AREA
BOARD AREA
(JUNCTION-TO-AMBIENT)
(JUNCTION-TO-AMBIENT)
THERMAL RESISTANCE
THERMAL RESISTANCE
25°C/W
27°C/W
35°C/W
60°C/W
62°C/W
65°C/W
69°C/W
73°C/W
80°C/W
83°C/W
Calculating Junction Temperature
The junction temperature can be calculated from the
equation:
where:
As an example, calculate the junction temperature for the
circuit in Figure 7 for the N8, S8, and R packages assuming
a 70°C ambient temperature.
The device dissipation can be found by measuring the
supply currents, calculating the total dissipation, and
then subtracting the dissipation in the load and feedback
network.
Then:
Since the maximum junction temperature is 150°C, the
N8 package is clearly unacceptable. Both the S8 and R
packages are usable.
T
for the N8 package.
T
for the S8 with 225 sq. mm topside heat sinking.
T
for the R package with 100 sq. mm topside heat
sinking.
330Ω
J
J
J
T
T
T
P
θ
P
J
J
A
D
JA
D
= (1.03W × 100°C/W) + 70°C = 173°C
= (1.03W × 65°C/W) × + 70°C = 137°C
= (1.03W × 35°C/W) × + 70°C = 106°C
= (P
= Junction Temperature
= Ambient Temperature
= Device Dissipation
= (39mA × 30V) – (12V)
= Thermal Resistance (Junction-to Ambient)
D
Figure 7. Thermal Calculation Example
× θ
+
–
–15V
15V
LT1206
I
JA
S/D
) + T
39mA
0.01µF
A
2k
2
2k
/(2k||2k) = 1.03W
1206 F07
300pF
f = 2MHz
1206fb
12V
–12V