MC33074ADR2G ON Semiconductor, MC33074ADR2G Datasheet - Page 22

• Manufacturer Part Number: MC33074ADR2G
• Description: IC OPAMP QUAD 4.5MHZ 14SOIC
• Manufacturer: ON Semiconductor
• Type: General Purpose Amplifierr

Specifications of MC33074ADR2G

• Amplifier Type: General Purpose
• Number Of Circuits: 4
• Slew Rate: 13 V/µs
• Gain Bandwidth Product: 4.5MHz
• Current - Input Bias: 100nA
• Voltage - Input Offset: 500µV
• Current - Supply: 1.9mA
• Current - Output / Channel: 30mA
• Voltage - Supply, Single/dual (±): 3 V ~ 44 V, ±1.5 V ~ 22 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Rail/rail I/o Type: No
• Number Of Elements: 4
• Unity Gain Bandwidth Product: 4.5MHz
• Common Mode Rejection Ratio: 80dB
• Input Offset Voltage: 3@5VmV
• Input Bias Current: 500nA
• Single Supply Voltage (typ): 5/9/12/15/18/24/28V
• Voltage Gain In Db: 100dB
• Power Supply Rejection Ratio: 80dB
• Power Supply Requirement: Single/Dual
• Shut Down Feature: No
• Single Supply Voltage (min): 3V
• Single Supply Voltage (max): 44V
• Dual Supply Voltage (min): ±1.5V
• Dual Supply Voltage (max): ±22V
• Technology: Bipolar
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 14
• Package Type: SOIC
• Number Of Channels: 4
• Voltage Gain Db: 100 dB
• Common Mode Rejection Ratio (min): 80 dB
• Input Voltage Range (max): Positive Rail - 1.8 V
• Input Voltage Range (min): Negative Rail
• Operating Supply Voltage: 44 V
• Supply Current: 7.6 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Maximum Dual Supply Voltage: +/- 22 V
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Compliant
• Other names: MC33074ADR2GOS; MC33074ADR2GOS; MC33074ADR2GOSTR

−T−
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
2X
D
S
S
L/2
C
14
1
0.36
G
14X
14X
*For additional information on our Pb−Free strategy and soldering
−V−
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
A
K
0.10 (0.004)
REF
8
7
SOLDERING FOOTPRINT*
M
−U−
1
PACKAGE DIMENSIONS
B
1.26
T
H
14X
U
http://onsemi.com
J J1
N
CASE 948G−01
S
N
TSSOP−14
DETAIL E
ISSUE B
V
7.06
S
DETAIL E
22
SECTION N−N
Ç Ç Ç
É É É
Ç Ç Ç
É É É
F
K1
K
0.25 (0.010)
M
DIMENSIONS: MILLIMETERS
−W−
NOTES:
0.65
PITCH
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
ANSI Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
4.90
4.30
0.05
0.50
0.50
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
5.10
4.50
1.20
0.15
0.75
0.60
0.20
0.16
0.30
0.25
8
_
0.193
0.169
0.002
0.020
0.020
0.004
0.004
0.007
0.007
MIN
−−− 0.047
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.006
0.030
0.024
0.008
0.006
0.012
0.010
MAX
8
_