MC33074ADR2G ON Semiconductor, MC33074ADR2G Datasheet - Page 24

• Manufacturer Part Number: MC33074ADR2G
• Description: IC OPAMP QUAD 4.5MHZ 14SOIC
• Manufacturer: ON Semiconductor
• Type: General Purpose Amplifierr

Specifications of MC33074ADR2G

• Amplifier Type: General Purpose
• Number Of Circuits: 4
• Slew Rate: 13 V/µs
• Gain Bandwidth Product: 4.5MHz
• Current - Input Bias: 100nA
• Voltage - Input Offset: 500µV
• Current - Supply: 1.9mA
• Current - Output / Channel: 30mA
• Voltage - Supply, Single/dual (±): 3 V ~ 44 V, ±1.5 V ~ 22 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Rail/rail I/o Type: No
• Number Of Elements: 4
• Unity Gain Bandwidth Product: 4.5MHz
• Common Mode Rejection Ratio: 80dB
• Input Offset Voltage: 3@5VmV
• Input Bias Current: 500nA
• Single Supply Voltage (typ): 5/9/12/15/18/24/28V
• Voltage Gain In Db: 100dB
• Power Supply Rejection Ratio: 80dB
• Power Supply Requirement: Single/Dual
• Shut Down Feature: No
• Single Supply Voltage (min): 3V
• Single Supply Voltage (max): 44V
• Dual Supply Voltage (min): ±1.5V
• Dual Supply Voltage (max): ±22V
• Technology: Bipolar
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 14
• Package Type: SOIC
• Number Of Channels: 4
• Voltage Gain Db: 100 dB
• Common Mode Rejection Ratio (min): 80 dB
• Input Voltage Range (max): Positive Rail - 1.8 V
• Input Voltage Range (min): Negative Rail
• Operating Supply Voltage: 44 V
• Supply Current: 7.6 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Maximum Dual Supply Voltage: +/- 22 V
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Compliant
• Other names: MC33074ADR2GOS; MC33074ADR2GOS; MC33074ADR2GOSTR

SEATING
PLANE
−T−
14
1
G
−A−
D
14 PL
0.25 (0.010)
M
*For additional information on our Pb−Free strategy and soldering
8
7
0.58
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−B−
14X
T
K
B
S
C
P
7 PL
A
SOLDERING FOOTPRINT*
S
0.25 (0.010)
PACKAGE DIMENSIONS
R
1
http://onsemi.com
X 45
CASE 751A−03
_
M
SOIC−14
ISSUE J
M
7.04
7X
B
24
M
DIMENSIONS: MILLIMETERS
J
1.52
14X
F
1.27
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
G
M
A
B
C
D
F
J
K
P
R
MILLIMETERS
MIN
8.55
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
1.27 BSC
0
_
MAX
8.75
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
MIN
0.050 BSC
0
INCHES
_
0.344
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_