B57364S209M EPCOS Inc, B57364S209M Datasheet - Page 10

CURRENT LIMITER INRSH 2 OHM 20%

B57364S209M

Manufacturer Part Number
B57364S209M
Description
CURRENT LIMITER INRSH 2 OHM 20%
Manufacturer
EPCOS Inc
Type
NTCr
Datasheets

Specifications of B57364S209M

Lead Spacing
0.295" (7.50mm)
R @ 25°c
2.0 Ohm
Current - Steady State Max
12A
Tolerance
±20%
Diameter
0.825" (21mm)
Thermistor Type
NTC
Resistance
2ohm
Beta Value (k)
2900
Svhc
No SVHC (18-Jun-2010)
Beta Value Lower Limit Temperature
25°C
Body Diameter
21mm
Current Max
12A
Lead Length
32mm
Termination Style
Radial
Operating Temperature Range
- 55 C to + 170 C
Current Rating
12 Amps
Power Rating
5.1 W
Mounting Style
Through Hole
Pin Count
2
Thermal Time Constant
100s
Percentage Of Resistance Tolerance @ 25c
±20
Accuracy
±3
Product Length (mm)
Not Requiredmm
Product Height (mm)
Not Requiredmm
Thermistor Tolerance
± 20%
Thermistor Case Style
Radial Leaded
No. Of Pins
2
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
R @ Current
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
495-4114
B57364S 209M
B57364S0209M000
B57364S0209M000
Q1848236
Q3180393
Q3247542
When subjecting leads to mechanical stress, the following should be observed:
Tensile stress on leads
During mounting and operation tensile forces on the leads are to be avoided.
Bending of leads
Bending of the leads directly on the thermistor body is not permissible.
A lead may be bent at a minimum distance of twice the wire's diameter +2 mm from the solder
joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet.
The bending radius should be at least 0.75 mm.
Twisting of leads
The twisting (torsion) by 180 of a lead bent by 90 is permissible at 6 mm from the bottom of the
thermistor body.
3
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused
by thermal expansion during the production process (curing / overmolding process) and during
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure
that the materials used (sealing / potting compound and plastic material) are chemically neutral.
4
If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are
recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are
permissible.
5
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.
Humidity, temperature and container materials are critical factors.
The components should be left in the original packing. Touching the metallization of unsoldered
thermistors may change their soldering properties.
Storage temperature:
Max. relative humidity (without condensation):
Solder the thermistors listed in this data book after shipment from EPCOS within the time speci-
fied:
Leaded components:
Please read Cautions and warnings and
Important notes at the end of this document.
Inrush current limiters
ICLs
Sealing and potting
Cleaning
Storage
Page 10 of 15
<95%, maximum 30 days per annum
24 months
25 C up to 45 C
B57364
S364

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