TEF6901AH/V2,518 NXP Semiconductors, TEF6901AH/V2,518 Datasheet - Page 103

• Manufacturer Part Number: TEF6901AH/V2,518
• Description: IC INTEGRATED CAR RADIO 64-QFP
• Manufacturer: NXP Semiconductors

Specifications of TEF6901AH/V2,518

• Modulation Or Protocol: AM, FM, WB
• Applications: AM/FM Radio Receiver
• Current - Receiving: 102mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Voltage - Supply: 8 V ~ 9 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Frequency: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935281178518; TEF6901AH/V2-T; TEF6901AH/V2-T

NXP Semiconductors
TEF6901A_3
Product data sheet
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 115. SnPb eutectic process (from J-STD-020C)
Table 116. Lead-free process (from J-STD-020C)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 115
and
Figure
116
45.
Rev. 03 — 20 March 2008
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
45) than a PbSn process, thus
220
220
350
TEF6901A
Integrated car radio
> 2000
260
245
245
© NXP B.V. 2008. All rights reserved.
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