MC13212 Freescale Semiconductor, MC13212 Datasheet - Page 63

• Manufacturer Part Number: MC13212
• Description: IC TXRX RF 2.4GHZ FLSH 32K 71LGA
• Manufacturer: Freescale Semiconductor
• Series: MC1321xr

Specifications of MC13212

• Frequency: 2.4GHz
• Data Rate - Maximum: 250kbps
• Modulation Or Protocol: 802.15.4 Zigbee
• Applications: General Purpose
• Power - Output: 3dBm
• Sensitivity: -92dBm
• Voltage - Supply: 1.8 V ~ 3.6 V
• Current - Receiving: 42mA
• Current - Transmitting: 35mA
• Data Interface: PCB, Surface Mount
• Memory Size: 32kB Flash, 2kB RAM
• Antenna Connector: PCB, Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 71-LGA
• Mounting Style: SMD/SMT
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

7
The following sections describe crystal requirements and RF port options for end user applications.
7.1
The 802.15.4 Standard requires that several frequency tolerances be kept within ± 40 ppm accuracy. This
means that a total offset up to 80 ppm between transmitter and receiver will still result in acceptable
performance. The MC1321x transceiver provides onboard crystal trim capacitors to assist in meeting this
performance. The primary determining factor in meeting the 802.15.4 Standard, is the tolerance of the
crystal oscillator reference frequency. A number of factors can contribute to this tolerance and a crystal
specification will quantify each of them:
7.1.1
Freescale requires that a 16 MHz crystal with a <9 pF load capacitance is used. The MC1321x does not
contain a reference divider, so 16 MHz is the only frequency that can be used. A crystal requiring higher
load capacitance is prohibited because a higher load on the amplifier circuit may compromise its
performance. The crystal manufacturer defines the load capacitance as that total external capacitance seen
across the two terminals of the crystal. The oscillator amplifier configuration used in the MC1321x
requires two balanced load capacitors from each terminal of the crystal to ground. As such, the capacitors
are seen to be in series by the crystal, so each must be <18 pF for proper loading.
In the
in conjunction with a crystal that requires an 8 pF load capacitance. The default internal trim capacitor
value (2.4 pF) and stray capacitance total value (6.8 pF) sum up to 9.2 pF giving a total of 16 pF. The value
for the stray capacitance was determined empirically assuming the default internal trim capacitor value and
for a specific board layout. A different board layout may require a different external load capacitor value.
The on-chip trim capability may be used to determine the closest standard value by adjusting the trim value
via the SPI and observing the frequency at CLKO. Each internal trim load capacitor has a trim range of
approximately 5 pF in 20 fF steps.
Initial tolerance for the internal trim capacitance is approximately ±15%.
Freescale Semiconductor
1. The initial (or make) tolerance of the crystal resonant frequency itself.
2. The variation of the crystal resonant frequency with temperature.
3. The variation of the crystal resonant frequency with time, also commonly known as aging.
4. The variation of the crystal resonant frequency with load capacitance, also commonly known as
5. Whether or not a frequency trim step will be performed in production
Figure 34
Application Considerations
pulling. This is affected by:
a) The external load capacitor values - initial tolerance and variation with temperature.
b) The internal trim capacitor values - initial tolerance and variation with temperature.
c) Stray capacitance on the crystal pin nodes - including stray on-chip capacitance, stray package
Crystal Oscillator Reference Frequency
capacitance and stray board capacitance; and its initial tolerance and variation with
temperature.
Crystal Oscillator Design Considerations
crystal reference schematic, the external load capacitors are shown as 6.8 pF each, used
MC13211/212/213 Technical Data, Rev. 1.8
63