MPX5100AP Freescale Semiconductor, MPX5100AP Datasheet - Page 5

• Manufacturer Part Number: MPX5100AP
• Description: SENSOR ABS PRESS 16.68 PSI MAX
• Manufacturer: Freescale Semiconductor
• Series: MPX5100r

Specifications of MPX5100AP

• Pressure Type: Absolute
• Operating Pressure: 2.2 ~ 16.7 PSI
• Port Size: Male, 0.194" (4.9276mm) Tube
• Output: 0.2 ~ 4.7V
• Accuracy: ±2.5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 6-SIP
• Mounting Style: Through Hole
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 5 V
• Supply Voltage (min): 4.75 V
• Supply Voltage (max): 5.25 V
• Supply Current: 7 mA
• Output Voltage: 4.7 V
• Shutdown: No
• Brand/series: MPX5100
• Current, Rating: 7 mAdc
• Function: Pressure
• Linearity: ± 2.5%
• Mounting Type: PCB
• Pressure, Operating: 2.17 to 16.68 PSI
• Primary Type: Pressure
• Range, Measurement: 14.5 PSI
• Response Time: 1 ms
• Sensing Mode: Strain Gauge
• Sensitivity: 4.5 mV⁄kPa
• Technology: Piezoresistive
• Temperature, Operating, Maximum: 125 °C
• Temperature, Operating, Minimum: -40 °C
• Termination: Solder
• Vg, Rating: 5 VDC
• Voltage, Offset: 0.2 VDC
• Voltage, Supply: 5 VDC
• Operating Pressure Range: 0 To 100kPa
• Connection Size: 4.928mm
• Sensitivity, V/p: 45mV/kPa
• Sensor Case Style: SIP
• No. Of Pins: 6
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Contains lead / RoHS Compliant

Sensors
Freescale Semiconductor
On-chip Temperature Compensation and Calibration
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in
output will saturate outside of the specified pressure range.
Absolute Sensing Chip in the basic chip carrier (Case 867). A
fluorosilicone gel isolates the die surface and wire bonds from
interfacing the output of the integrated sensor to the A/D input
Lead Frame
Figure 3
Figure 4
Figure 5
Wire Bond
Fluorosilicone
Gel Die Coat
shows the sensor output signal relative to
illustrates both the Differential/Gauge and the
shows the recommended decoupling circuit for
Differential/Gauge Element
Die
Figure 5. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646.)
1.0 μF
5
4
1
0
3
2
Figure 4. Cross Sectional Diagrams (not to scale)
V
± (Pressure Error * Temperature Factor * 0.009 * V
V
PE = 2.5
TM = 1
TEMP = 0 to 85°C
out
S
MAX
Stainless Steel
= 5.0 V ± 0.25 Vdc
Metal Cover
Figure 3. Output vs. Pressure Differential
= V
S
*(0.009*P+0.04)
Figure
0.01 μF
Epoxy Plastic
Die Bond
Case
5. The
Pressure (kPa)
MIN
+5.0 V
Vs
GND
the environment, while allowing the pressure signal to be
transmitted to the sensor diaphragm.
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
TYP
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Lead Frame
IPS
IPS
Wire Bond
The MPX5100 series pressure sensor operating
S
)
V
OUT
Fluorosilicone Gel
Die Coat
470 pF
OUTPUT
OUTPUT
Absolute Element
Offset
(Typ)
Die
Stainless Steel
Pressure
Metal Cover
Epoxy Plastic
Die Bond
Case
MPX5100
5