MPXA6400AP Freescale Semiconductor, MPXA6400AP Datasheet - Page 4

• Manufacturer Part Number: MPXA6400AP
• Description: IC PRESSURE SENSOR 8-SOP
• Manufacturer: Freescale Semiconductor

Specifications of MPXA6400AP

• Pressure Type: Absolute
• Operating Pressure: 3 ~ 58 PSI
• Port Size: Male, 0.13" (3.302mm) Tube
• Output: 0.2 ~ 4.8V
• Voltage - Supply: 4.64 V ~ 5.36 V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOP Side Port
• Accuracy: 1.5 %
• Output Type: Analog
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Supply Voltage (min): 4.64 VDC
• Supply Voltage (max): 5.36 VDC
• Supply Current: 6 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MPXH6400A
4
Super Small Outline chip carrier (Case 1317).
illustrates a typical application circuit (output source current
operation).
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
Figure 1
Figure 3.
Pressure
illustrates the absolute sensing chip in the basic
shows the sensor output signal relative to
Lead Frame
Sealed Vacuum Reference
100 nF
Wire Bond
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
Fluoro Silicone
0
Gel Die Coat
Figure 1. Cross Sectional Diagram SSOP
Transfer Function:
V
Temperature = 0 to 85°C
V
Figure 3. Output vs. Absolute Pressure
S
OUT
Figure 2. Typical Application Circuit
= 5.0 V
(Output Source Current Operation)
Figure 2.
= V
+5.0 V
V
GND Pin 3
S
S
MPXxx6400A
DC
Pressure (Reference to Sealed Vacuum) in kPa
x (0.002421xP–0.00842 ± Error
Pin 2
MAX
Absolute Element
V
OUT
(not to scale)
Pin 4
P1
MIN
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXxx6400A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
A fluorosilicone gel isolates the die surface and wire bonds
Die
47 pF
TYP
Die Bond
Stainless Steel Cap
51 K
Thermoplastic Case
To ADC
Freescale Semiconductor
Sensors