MP3V5004DP Freescale Semiconductor, MP3V5004DP Datasheet

IC PRESSURE SENSOR 8-SOP

MP3V5004DP

Manufacturer Part Number
MP3V5004DP
Description
IC PRESSURE SENSOR 8-SOP
Manufacturer
Freescale Semiconductor
Type
Differentialr
Datasheet

Specifications of MP3V5004DP

Pressure Type
Differential
Operating Pressure
0.57 PSI, 3.92 kPa
Port Size
Male, 0.13" (3.302mm) Tube, Dual
Output
0.6 ~ 3 V
Voltage - Supply
2.7 V ~ 3.3 V
Termination Style
PCB
Operating Temperature
0°C ~ 85°C
Package / Case
8-SOP Dual Port
Mounting
Surface Mount
Pin Count
8
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Package Type
SNSR
Operating Supply Voltage (typ)
3V
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.3V
Accuracy
1.5 %, 2.5 %
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
0 C
Operating Supply Voltage
3 V
Supply Voltage (min)
2.7 V
Supply Voltage (max)
3.3 V
Supply Current
10 mA
Output Voltage
0.6 V to 3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MP3V5004DP
Manufacturer:
MOT
Quantity:
101
Freescale Semiconductor
© Freescale Semiconductor, Inc., 2008, 2010. All rights reserved.
Small Outline Package (MP3V5004 Series)
MP3V5004GC6U
MP3V5004GC6T1
MP3V5004DP
MP3V5004GVP
MP3V5004GP
Integrated Silicon Pressure Sensor,
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
monolithic silicon pressure sensor designed for a wide range of
applications, but particularly those employing a microcontroller or
microprocessor with A/D inputs. This sensor combines a highly sensitive
implanted strain gauge with advanced micromachining techniques, thin-film
metallization, and bipolar processing to provide an accurate, high level
analog output signal that is proportional to the applied pressure.
Features
• Temperature Compensated from 10°C to 60°C
• Available in Gauge Surface Mount (SMT) Configuration
• Durable Thermoplastic (PPS) Package
The MP3V5004G series piezoresistive transducer is a state-of-the-art
Device Name
MP3V5004GC6U/6T1
CASE 482A
Tape & Reel
Package
Options
Trays
Trays
Trays
Rail
Case
482A
482A
1351
1368
1369
No.
SMALL OUTLINE PACKAGES
MP3V5004DP
CASE 1351
ORDERING INFORMATION
None
# of Ports
Single
Dual
MP3V5004GVP
CASE 1368
Gauge
Typical Applications
• Washing Machine Water Level
• Ideally Suited for Microprocessor or
Pressure Type
Differential
Microcontroller-Based Systems
0 to 3.92 kPa (0 to 400 mm H
MP3V5004G
0.6 to 3.0 V Output
MP3V5004GP
CASE 1369
Absolute
Series
Pressure
Rev 2, 06/2010
Device Marking
MP3V5004DP
MP3V5004GV
MP3V5004GP
MP3V5004G
MP3V5004G
MP3V5004G
2
O)

Related parts for MP3V5004DP

MP3V5004DP Summary of contents

Page 1

... H 2 0.6 to 3.0 V Output Typical Applications • Washing Machine Water Level • Ideally Suited for Microprocessor or Microcontroller-Based Systems Pressure Type Device Marking Differential Absolute • MP3V5004G • MP3V5004G • MP3V5004DP • MP3V5004GV • MP3V5004GP MP3V5004GP CASE 1369 O) ...

Page 2

... Min Typ Max Unit 0 — 3.92 kPa 400 mm H 2.7 3.0 3.3 V — — 10 mAdc — 1.8 — 0.45 0.6 0.75 — 0.6 — V/kPa 5.9 mV/mm H — — ±1.5 %V — — ±2 25°C. FSS Sensors Freescale Semiconductor FSS FSS ...

Page 3

... Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Figure 1. Fully Integrated Pressure Sensor Schematic Sensors Freescale Semiconductor Symbol P MAX T STG T A ...

Page 4

... Max Min 2 kPa 200 (See Note 5 in Operating Characteristics table) shows the recommended decoupling circuit for shows the sensor output signal relative OUTPUT V out V s IPS 0.01 μF GND 470 pF Output Filtering. Note AN1646.) 4 kPa 400 FSS Freescale Semiconductor Figure 3 Sensors ...

Page 5

... The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Part Number MP3V5004GC6U/T1 MP3V5004GP MP3V5004DP MP3V5004GVP MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package ...

Page 6

... G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1. 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 –T– SEATING PLANE Sensors Freescale Semiconductor ...

Page 7

... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE Pressure MP3V5004G 7 ...

Page 8

... Pressure MP3V5004G 8 PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE Sensors Freescale Semiconductor ...

Page 9

... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1368-01 ISSUE C SMALL OUTLINE PACKAGE Pressure MP3V5004G 9 ...

Page 10

... Pressure MP3V5004G 10 PACKAGE DIMENSIONS CASE 1368-01 ISSUE C SMALL OUTLINE PACKAGE Sensors Freescale Semiconductor ...

Page 11

... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1368-01 ISSUE C SMALL OUTLINE PACKAGE Pressure MP3V5004G 11 ...

Page 12

... Pressure MP3V5004G 12 PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE Sensors Freescale Semiconductor ...

Page 13

... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE Pressure MP3V5004G 13 ...

Page 14

... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...

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