MP3V7007DP Freescale Semiconductor, MP3V7007DP Datasheet

IC PRESSURE SENSOR 8-SOP

MP3V7007DP

Manufacturer Part Number
MP3V7007DP
Description
IC PRESSURE SENSOR 8-SOP
Manufacturer
Freescale Semiconductor
Series
MP3V7007r
Datasheet

Specifications of MP3V7007DP

Pressure Type
Differential
Operating Pressure
±1 PSI
Port Size
Male, 0.13" (3.302mm) Tube, Dual
Output
0.5 ~ 4.5 V Ratiometric
Voltage - Supply
4.75 V ~ 5.25 V
Termination Style
PCB
Operating Temperature
-40°C ~ 125°C
Package / Case
8-SOP Dual Port
Accuracy
5 %
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
3 V
Supply Voltage (min)
2.7 V
Supply Voltage (max)
3.3 V
Supply Current
7 mA
Output Voltage
0.2 V to 2.8 V
Operating Pressure Range
-7 To 7kPa
Connection Size
0.13"
Sensitivity, V/p
171mV/kPa
Sensor Case Style
SOP
No. Of Pins
8
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Freescale Semiconductor
© Freescale Semiconductor, Inc., 2008. All rights reserved.
monolithic silicon pressure sensors designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This transducer combines advanced micromachining techniques, thin-
film metallization, and bipolar processing to provide an accurate, high level
analog output signal that is proportional to the applied pressure.
Features
Small Outline Package (MP3V7007 Series)
MP3V7007GC6U
MP3V7007GC6T1
MP3V7007GP
MP3V7007DP
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
• 5.0% Maximum Error Over 0° to 85°C
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated Over –40° to +125°C
• Thermoplastic (PPS) Surface Mount Package
• Patented Silicon Shear Stress Strain Gauge
• Available in Differential and Gauge Configurations
The MP3V7007 series piezoresistive transducers are state-of-the-art
Device Name
Tape & Reel
Package
Options
Trays
Trays
Rails
MP3V7007GC6U/C6T1
CASE 482A-01
Case
482A
482A
1369
1351
No.
SMALL OUTLINE PACKAGE
ORDERING INFORMATION
None
# of Ports
CASE 1369-01
MP3V7007GP
Single
Dual
Gauge
CASE 1351-01
MP3V7007DP
Application Examples
Pressure Type
Hospital Beds
HVAC
Respiratory Systems
Process Control
Differential
-7 to 7 kPa (-1 to 1 psi)
MP3V7007
0.2 to 2.8 V Output
Series
Absolute
Pressure
Rev 0, 11/2008
MP3V7007G
MP3V7007G
MP3V7007GP
MP3V7007DP
MP3V7007
Marking
Device

Related parts for MP3V7007DP

MP3V7007DP Summary of contents

Page 1

... MP3V7007 Rev 0, 11/2008 MP3V7007 Series - kPa (- psi) 0.2 to 2.8 V Output Application Examples • Hospital Beds • HVAC • Respiratory Systems • Process Control Pressure Type Device Marking Gauge Differential Absolute MP3V7007G • MP3V7007G • MP3V7007GP • MP3V7007DP • MP3V7007DP CASE 1351-01 ...

Page 2

... FSS ±5.0 — — — — 171 — t — 1.0 — R — 0.1 — O+ — — 20 — ±0.5 — — — 25°C. FSS Freescale Semiconductor Unit kPa Vdc mAdc Vdc Vdc Vdc %V FSS mV/kPa ms mAdc ms %V FSS Sensors ...

Page 3

... Storage Temperature Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Sensing Element Figure 1. Integrated Pressure Sensor Schematic Sensors Freescale Semiconductor Symbol P max T stg ...

Page 4

... Element Figure 2. Cross-Sectional Diagram SOP (not to scale out V s IPS 1.0 μF GND 0.01 μF shows the recommended decoupling circuit for shows the sensor output signal relative to Figure Stainless Steel Cap Thermoplastic Case Die Bond OUTPUT 470 pF Freescale Semiconductor 3. The Sensors ...

Page 5

... Temperature Error Band 4.0 3.0 Temperature 2.0 Error Factor 1.0 0.0 NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Sensors Freescale Semiconductor Transfer Function *(0.057*P+0.5) ± ERROR out 3.0 Vdc S TEMP = 0 to 85°C ...

Page 6

... The pressure Part Number MP3V7007GC6U/C6T1 MP3V7007GP MP3V7007DP MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package ...

Page 7

... N - Sensors Freescale Semiconductor PACKAGE DIMENSIONS 0.25 (0.010 PIN 1 IDENTIFIER M CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE Pressure NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. ...

Page 8

... BSC 2.54 BSC F 0.240 0.260 6.10 6.60 K 0.115 0.135 2.92 3.43 L 0.040 0.060 1.02 1.52 M 0.270 0.290 6.86 7.37 N 0.160 0.180 4.06 4.57 P 0.009 0.011 0.23 0.28 T 0.110 0.130 2.79 3.30 θ 0˚ 7˚ 0˚ 7˚ Freescale Semiconductor Sensors ...

Page 9

... PLACES 4 TIPS 0.008 (0.20 0.004 (0. ∅ 0.004 (0. DETAIL G C Sensors Freescale Semiconductor PACKAGE DIMENSIONS GAGE e PLANE e/2 .014 (0.35 SEATING PLANE CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE Pressure θ DETAIL G NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. ...

Page 10

... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...

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