MP3H6115AC6U Freescale Semiconductor, MP3H6115AC6U Datasheet - Page 4

• Manufacturer Part Number: MP3H6115AC6U
• Description: IC PRESSURE SENSOR 16.7PSI 8SSOP
• Manufacturer: Freescale Semiconductor
• Series: MP3H6115Ar

Specifications of MP3H6115AC6U

• Pressure Type: Absolute
• Operating Pressure: 2.2 ~ 16.7 PSI
• Port Size: Male, 0.13" (3.302mm) Tube
• Output: 0.12 ~ 2.8V
• Voltage - Supply: 2.7 V ~ 3.3 V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SSOP with Port
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 3 V
• Output Voltage: 2.78 V to 2.861 V
• Lead Free Status / RoHS Status: Contains lead / RoHS Compliant

MP3H6115A
4
On-chip Temperature Compensation and Calibration
Super Small Outline chip carrier (Case 1317).
current operation).
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
Figure 2
Figure 3
Figure 4
Pressure
illustrates the absolute sensing chip in the basic
shows a typical application circuit (output source
shows the sensor output signal relative to
100 nF
Lead frame
Figure 2. Cross Sectional Diagram SSOP (not to scale)
Wire Bond
2.75
2.25
1.75
1.25
0.75
0.25
3.0
2.5
2.0
1.5
1.0
0.5
Fluoro Silicone
0
Gel Die Coat
Sealed Vacuum Reference
Figure 4. Output versus Absolute Pressure
Transfer Function:
V
Temp = 0 to 85°C
V
S
OUT
= 3.0 V
Figure 3. Typical Application Circuit
(Output Source Current Operation)
= V
+3 V
GND
S
V
GND Pin 3
DC
x (.009xP–.095) ± Error
S
Pressure (Reference to Sealed Vacuum) in kPa
MP3H6115A
Pin 2
Absolute Element
V
OUT
Pin 4
P1
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MP3H6115A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Die
A fluorosilicone gel isolates the die surface and wire bonds
Min
Max
47 pF
Die Bond
Stainless Steel
Thermoplastic
Cap
Case
51 K
Typ
to ADC
Freescale Semiconductor
Sensors