TSOP75D25TT Vishay, TSOP75D25TT Datasheet - Page 8

Infrared Receivers IR SENSOR IC 25KHZ for 3D-TV glasses

TSOP75D25TT

Manufacturer Part Number
TSOP75D25TT
Description
Infrared Receivers IR SENSOR IC 25KHZ for 3D-TV glasses
Manufacturer
Vishay
Datasheet

Specifications of TSOP75D25TT

Carrier Frequency
25 KHz
Transmission Distance
45 m
Viewing Angle
+/- 50 deg
Output Current
5 mA
Operating Voltage
2.5 V to 5.5 V
Supply Current
0.35 mA, 0.45 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 25 C
Package / Case
TSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
TSOP75D25
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 72 h while stored
• Set the furnace temperatures for pre-heating and heating
• Handling after reflow should be done only after the work
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under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
in accordance with the reflow temperature profile as
shown in the diagram. Excercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
surface has been cooled off
mold residue
Drawing-No.: 6.550-5297.01-4
Issue: 3; 02.09.09
21576
Tool separation line
(4x)
0.5 ± 0.1
GND
3 x
Vs
Marking area
IR Receiver Modules for 3D
1.27
6.6 ± 0.1
(3.4)
(2.2)
Synchronization Signals
6.8
2.2
1.27
(3x)
=
Out
(0.635)
3.81
GND
Pick and place area
(R 1.3)
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
mold residue
temperature of the soldering iron below 300 °C
Not indicated tolerances ± 0.15
1.27
Proposed hole layout
from component side
(for reference only)
(1)
0.8
technical drawings
according to DIN
specifications
3 x 1.27 = 3.81
2.5
3.2
Document Number: 83311
Rev. 1.0, 31-Mar-10

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