A2F200M3F-1FGG256 Actel, A2F200M3F-1FGG256 Datasheet - Page 142

• Manufacturer Part Number: A2F200M3F-1FGG256
• Description: FPGA - Field Programmable Gate Array 200K System Gates SmartFusion
• Manufacturer: Actel

Specifications of A2F200M3F-1FGG256

• Processor Series: A2F200
• Core: ARM Cortex M3
• Number Of Logic Blocks: 8
• Maximum Operating Frequency: 120 MHz
• Number Of Programmable I/os: 117
• Data Ram Size: 4608 bit
• Delay Time: 200 ns
• Supply Voltage (max): 3.6 V
• Supply Current: 3 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: 0 C
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: A2F-Eval-Kit, A2F-Dev-Kit, FlashPro 3, FlashPro Lite, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.425 V
• Number Of Gates: 200000
• Package / Case: FPBGA-256
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Pin Descriptions
5- 32
Note:
Pin Number
W10
W11
W12
W13
W14
W15
W16
W17
W18
W19
W21
U10
U11
U12
U13
U14
U15
U16
U17
U19
U21
V19
V21
Y21
W1
W3
W4
W5
W6
W7
W8
W9
U9
V1
V3
Y1
Shading denotes pins that do not have completely identical functions from density to density. For
example, the bank assignment can be different for an I/O, or the function might be available only
on a larger density device.
SPI_1_CLK/GPIO_26
SPI_0_CLK/GPIO_18
SPI_1_DO/GPIO_24
SPI_0_DO/GPIO_16
SPI_0_SS/GPIO_19
SPI_1_DI/GPIO_25
SPI_0_DI/GPIO_17
A2F200 Function
VCCMSSIOB2
VCC33ADC0
GND15ADC1
VCC33ADC1
GND33ADC0
VCC15ADC1
GND33ADC1
VCC33SDD1
GNDSDD0
GNDSDD1
MAC_CLK
VCC33AP
GNDTM1
PTBASE
GNDAQ
ABPS6
ABPS5
ADC7
PCAP
NCAP
ADC0
ADC3
ADC5
GND
CM0
TM0
TM1
CM3
CM2
R e visio n 6
288-Pin CSP
SPI_1_CLK/GPIO_26
SPI_0_CLK/GPIO_18
SPI_1_DO/GPIO_24
SPI_0_DO/GPIO_16
SPI_0_SS/GPIO_19
SPI_1_DI/GPIO_25
SPI_0_DI/GPIO_17
A2F500 Function
VCCMSSIOB2
VCC33ADC0
GND15ADC1
VCC33ADC1
GND33ADC0
VCC15ADC1
GND33ADC1
VCC33SDD1
GNDSDD0
GNDSDD1
MAC_CLK
VCC33AP
GNDTM1
PTBASE
GNDAQ
ABPS6
ABPS5
ADC7
PCAP
NCAP
ADC0
ADC3
ADC5
GND
CM0
TM0
TM1
CM3
CM2