MPL115A1 Freescale Semiconductor, MPL115A1 Datasheet - Page 5

• Manufacturer Part Number: MPL115A1
• Description: Board Mount Pressure Sensors SPI VERSION PEGASUS
• Manufacturer: Freescale Semiconductor
• Type: Absoluter

Specifications of MPL115A1

• Operating Pressure: 50 kPa to 115 kPa
• Pressure Type: Absolute
• Output Type: Digital
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 3.3 V
• Supply Voltage (min): 2.375 V
• Supply Voltage (max): 5.5 V
• Supply Current: 5 uA
• Package / Case: LGA-8
• Digital Output - Number Of Bits: 10
• Output Voltage: 0.4 V to 0.6 V
• Shutdown: Yes
• Pressure Range: 50 to 115KPa
• Mounting: Surface Mount
• Pin Count: 8
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Package Type: LGA
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 2.375V
• Operating Supply Voltage (max): 5.5V
• Lead Free Status / Rohs Status: Compliant

Sensors
Freescale Semiconductor
Solder Recommendations
NOTE: The stress level and signal offset of the device also depends on the board type, board core material, board thickness
Handling Recommendations
It is recommended to handle the MPL115A pressure sensor with a vacuum pick and place tool. Sharp objects utilized to move
the MPL115A pressure sensor increase the possibility of damage via a foreign object/tool into the small exposed port.
The sensor die is sensitive to light exposure. Direct light exposure through the port hole can lead to varied accuracy of pressure
measurement. Avoid such exposure to the port during normal operation.
1.
2.
Use SAC solder alloy (i.e., Sn-Ag-Cu) with a melting point of about 217°C. It is recommended to use SAC305
(i.e., Sn-3.0 wt.% Ag-0.5 wt.% Cu).
Reflow
• Ramp up rate: 2 to 3 C/s.
• Preheat flat (soak): 110 to 130s.
• Reflow peak temperature: 250
• Time above 217°C: 40 to 90s (depends on board type, thermal mass of the board/quantities in the reflow).
• Ramp down: 5 to 6 C/s.
• Using an inert reflow environment (with O2 level about 5 to 15 ppm).
and metal finishing of the board.
°
C to 260°C (depends on exact SAC alloy composition).
Pressure
MPL115A1
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