GJM1555C1HR50BB01D Murata, GJM1555C1HR50BB01D Datasheet - Page 10

• Manufacturer Part Number: GJM1555C1HR50BB01D
• Description: Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 0402 0.5pF 50volts C0G +/-0.1pF
• Manufacturer: Murata
• Series: GJMr

Specifications of GJM1555C1HR50BB01D

• Voltage Rating: 50 Volts
• Operating Temperature Range: - 55 C to + 125 C
• Temperature Coefficient / Code: C0G (NP0)
• Product: General Type MLCCs
• Dimensions: 0.5 mm W x 1 mm L x 0.5 mm H
• Termination Style: SMD/SMT
• Capacitance: 0.5 pF
• Tolerance: 0.1 pF
• Package / Case: 0402 (1005 metric)
• Capacitance Tolerance: ± 0.1pF
• Capacitor Dielectric Type: Ceramic Multi-Layer
• Capacitor Case Style: 0402
• No. Of Pins: 2
• Lead Spacing: 0.3mm
• Operating Temperature: RoHS Compliant
• Svhc: No SVHC (15-Dec-2010)
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

!Note
ï This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, itís specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
ï This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
C-29-C
A p p l i c At i o n S p e c i F i c c A pA c i t o r S
High Frequency Ceramic Capacitors
GJM Soldering and Mounting
!Note
1. Mounting Position
2. Chip Placing
!Caution (Soldering and Mounting)
Choose a mounting position that minimizes the stress
An excessively low bottom dead point of the suction
Dirt particles and dust accumulated between the suction
imposed on the chip during flexing or bending of the
board.
nozzle imposes great force on the chip during mounting,
causing cracked chips. So adjust the suction nozzle's
bottom dead point by correcting warp in the board.
Normally, the suction nozzle's bottom dead point must be
set on the upper surface of the board. Nozzle pressure
for chip mounting must be a 1 to 3N static load.
nozzle and the cylinder inner wall prevent the nozzle from
moving smoothly. This imposes great force on the chip
during mounting, causing cracked chips. And the locating
claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction
nozzle and the locating claw must be maintained,
checked and replaced periodically.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
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w
w
w
.
m
u
r
a
t
a
Component Direction
Chip Mounting Close to Board Separation Point
Incorrect
Correct
.
c
o
Perforation
m
Suction Nozzle
Board
A
Slit

B
Support Pin
D
C
Deflection
Continued on the following page.
Innovator in Electronics – 15
Chip arrangement
Worst A-C-(B~D) Best
!Caution
Locate chip
horizontal to the
direction in
which stress
acts
Board Guide
C02E.pdf
83
07.2.6
13