GJM1555C1HR50BB01D Murata, GJM1555C1HR50BB01D Datasheet - Page 11

• Manufacturer Part Number: GJM1555C1HR50BB01D
• Description: Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 0402 0.5pF 50volts C0G +/-0.1pF
• Manufacturer: Murata
• Series: GJMr

Specifications of GJM1555C1HR50BB01D

• Voltage Rating: 50 Volts
• Operating Temperature Range: - 55 C to + 125 C
• Temperature Coefficient / Code: C0G (NP0)
• Product: General Type MLCCs
• Dimensions: 0.5 mm W x 1 mm L x 0.5 mm H
• Termination Style: SMD/SMT
• Capacitance: 0.5 pF
• Tolerance: 0.1 pF
• Package / Case: 0402 (1005 metric)
• Capacitance Tolerance: ± 0.1pF
• Capacitor Dielectric Type: Ceramic Multi-Layer
• Capacitor Case Style: 0402
• No. Of Pins: 2
• Lead Spacing: 0.3mm
• Operating Temperature: RoHS Compliant
• Svhc: No SVHC (15-Dec-2010)
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

13
Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
16 – Innovator in Electronics
A p p l i c At i o n S p e c i F i c c A pA c i t o r S
High Frequency Ceramic Capacitors
GJM Soldering and Mounting
3. Reflow Soldering
Table 1
Table 1
Table 1
Recommended Conditions
Recommended Conditions
Recommended Conditions
8 4
Peak Temperature
Peak Temperature
Peak Temperature
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Pb-Sn Solder: Sn-37Pb
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Lead Free Solder: Sn-3.0Ag-0.5Cu
Note
Inverting the PCB
Inverting the PCB
Inverting the PCB
Optimum Solder Amount for Reflow Soldering
Optimum Solder Amount for Reflow Soldering
Optimum Solder Amount for Reflow Soldering
Reflow Soldering
When sudden heat is applied to the components, the
mechanical strength of the components should go down
because remarkable temperature change causes
deformity inside components. In order to prevent
mechanical damage in the components, preheating should
Reflow Soldering
When sudden heat is applied to the components, the
be required for both of the components and the PCB board.
When sudden heat is applied to the components, the
mechanical strength of the components should go down
Preheating conditions are shown in Table 1. It is required to
mechanical strength of the components should go down
because remarkable temperature change causes
keep temperature differential between the soldering and
because remarkable temperature change causes
deformity inside components. In order to prevent
the components surface ( T) as small as possible.
deformity inside components. In order to prevent
mechanical damage in the components, preheating should
Solderability of Tin plating termination chip might be
mechanical damage in the components, preheating should
be required for both of the components and the PCB board.
deteriorated when low temperature soldering profile where
be required for both of the components and the PCB board.
Preheating conditions are shown in Table 1. It is required to
peak solder temperature is below the Tin melting point is
Preheating conditions are shown in Table 1. It is required to
keep temperature differential between the soldering and
used. Please confirm the solderability of Tin plating
keep temperature differential between the soldering and
the components surface ( T) as small as possible.
termination chip before use.
the components surface ( T) as small as possible.
Solderability of Tin plating termination chip might be
When components are immersed in solvent after mounting,
Solderability of Tin plating termination chip might be
deteriorated when low temperature soldering profile where
be sure to maintain the temperature difference ( T)
deteriorated when low temperature soldering profile where
peak solder temperature is below the Tin melting point is
between the component and solvent within the range
peak solder temperature is below the Tin melting point is
used. Please confirm the solderability of Tin plating
shown in the Table 1.
used. Please confirm the solderability of Tin plating
termination chip before use.
termination chip before use.
When components are immersed in solvent after mounting,
When components are immersed in solvent after mounting,
be sure to maintain the temperature difference ( T)
be sure to maintain the temperature difference ( T)
between the component and solvent within the range
between the component and solvent within the range
shown in the Table 1.
shown in the Table 1.
Make sure not to impose an abnormal mechanical shock on
the PCB.
Make sure not to impose an abnormal mechanical shock on
Make sure not to impose an abnormal mechanical shock on
the PCB.
the PCB.
Atmosphere
Atmosphere
Atmosphere
Continued from the preceding page.
GRM02/03/15/18/21/31
GJM03/15
ERB18/21
GQM18/21
GRM02/03/15/18/21/31
GJM03/15
GRM02/03/15/18/21/31
GRM32/43/55
LLL15/18/21/31
GJM03/15
GJM03/15
GNM
ERB18/21
ERB18/21
ERB32
GQM18/21
GQM18/21
GRM32/43/55
LLA18/21/31
GRM32/43/55
LLM21/31
GNM
GNM
ERB32
ERB32
Caution
• Please read rating and
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Overly thick application of solder paste results in
Overly thick application of solder paste results in
Too little solder paste results in a lack of adhesive
Overly thick application of solder paste results in
Make sure the solder has been applied smoothly to the
Too little solder paste results in a lack of adhesive
Too little solder paste results in a lack of adhesive
Make sure the solder has been applied smoothly to the
Make sure the solder has been applied smoothly to the
excessive fillet height solder.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
cracked chips.
excessive fillet height solder.
strength on the outer electrode, which may result in
excessive fillet height solder.
This makes the chip more susceptible to mechanical
chips breaking loose from the PCB.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
and thermal stress on the board and may cause
cracked chips.
end surface to a height of 0.2mm min.
cracked chips.
strength on the outer electrode, which may result in
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
chips breaking loose from the PCB.
end surface to a height of 0.2mm min.
end surface to a height of 0.2mm min.
Part Number
Part Number
Part Number
Infrared Reflow
Infrared Reflow
Infrared Reflow
230-250 C
230-250 C
230-250 C
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
Air
Air
Air
Pb-Sn Solder
Pb-Sn Solder
Pb-Sn Solder
Vapor Reflow
Vapor Reflow
Vapor Reflow
230-240 C
230-240 C
230-240 C
Air
Air
Air
Temperature Differential
Temperature Differential
Temperature Differential

T 190
T 190
T 130
T 190
T 130
T 130
Lead Free Solder
Lead Free Solder
Lead Free Solder
w
240-260 C
240-260 C
240-260 C
Air or N
Air or N
Air or N
w
2
2
2
w
.
m
u
Standard Conditions for Reflow Soldering
Peak Temperature
Standard Conditions for Reflow Soldering
Standard Conditions for Reflow Soldering
Peak Temperature
Peak Temperature
Peak Temperature
Peak Temperature
Peak Temperature
Allowable Soldering Temperature and Time
Allowable Soldering Temperature and Time
Allowable Soldering Temperature and Time
Optimum Solder Amount for Reflow Soldering
Optimum Solder Amount for Reflow Soldering
Optimum Solder Amount for Reflow Soldering
Temperature ( )
Temperature ( )
Temperature ( )
Temperature ( )
Temperature ( )
Temperature ( )
r
a
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
In case of repeated soldering, the accumulated
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
soldering time must be within the range shown above.
280
270
260
250
240
280
280
230
270
220
270
260
260
250
250
240
240
230
230
220
220
200 C
170 C
150 C
130 C
200 C
200 C
170 C
170 C
150 C
150 C
130 C
130 C
170 C
150 C
130 C
170 C
170 C
150 C
150 C
130 C
130 C
t
0
0
0
a
Infrared Reflow
Infrared Reflow
Infrared Reflow
Vapor Reflow
Vapor Reflow
Vapor Reflow
T
T
T
T
T
T
.
30
30
30
c
60-120 seconds 30-60 seconds
60-120 seconds 30-60 seconds
60-120 seconds 30-60 seconds
60-120 seconds
60-120 seconds
60-120 seconds
Preheating
Preheating
Preheating
Preheating
Preheating
Preheating
o
m
60
60
60
Continued on the following page.
Continued on the following page.
Continued on the following page.
Soldering
Soldering
Soldering
20 seconds max.
20 seconds max.
20 seconds max.
Soldering
Soldering
Soldering

Soldering Time (sec.)
Soldering Time (sec.)
Soldering Time (sec.)
90
90
90
Gradual
Cooling
Gradual
Cooling
Gradual
Cooling
Gradual
Cooling
Gradual
Cooling
Gradual
Cooling
Time
Time
Time
Time
Time
Time
0.2mm min.
0.2mm min.
0.2mm min.
120
120
120
C02E.pdf
C-29-C
07.2.6