BSZ16DN25NS3G Infineon Technologies, BSZ16DN25NS3G Datasheet - Page 2

MOSFET N-CH 250V 10.9A 8TDSON

BSZ16DN25NS3G

Manufacturer Part Number
BSZ16DN25NS3G
Description
MOSFET N-CH 250V 10.9A 8TDSON
Manufacturer
Infineon Technologies
Series
OptiMOS™r
Datasheet

Specifications of BSZ16DN25NS3G

Input Capacitance (ciss) @ Vds
920pF @ 100V
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
165 mOhm @ 5.5A, 10V
Drain To Source Voltage (vdss)
250V
Current - Continuous Drain (id) @ 25° C
10.9A
Vgs(th) (max) @ Id
4V @ 32µA
Gate Charge (qg) @ Vgs
11.4nC @ 10V
Power - Max
62.5W
Mounting Type
Surface Mount
Package / Case
8-PowerTDFN
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
146 mOhms
Forward Transconductance Gfs (max / Min)
14 S, 7 S
Drain-source Breakdown Voltage
250 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
10.9 A
Power Dissipation
62.5 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BSZ16DN25NS3GTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BSZ16DN25NS3G
Manufacturer:
INFINEON
Quantity:
1 001
Part Number:
BSZ16DN25NS3G
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Part Number:
BSZ16DN25NS3GATMA1
0
Rev. 2.1
3)
connection. PCB is vertical in still air.
Parameter
Thermal characteristics
Thermal resistance, junction - case
Thermal resistance,
junction - ambient
Electrical characteristics, at T
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
Zero gate voltage drain current
Gate-source leakage current
Drain-source on-state resistance
Gate resistance
Transconductance
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
j
=25 °C, unless otherwise specified
Symbol Conditions
R
R
V
V
I
I
R
R
g
DSS
GSS
fs
(BR)DSS
GS(th)
thJC
thJA
DS(on)
G
6 cm
V
V
V
T
V
T
V
V
|V
I
D
j
j
GS
DS
DS
DS
GS
GS
=5.5 A
=25 °C
=125 °C
DS
page 2
=V
=200 V, V
=200 V, V
=0 V, I
=20 V, V
=10 V, I
|>2|I
2
cooling area
GS
D
, I
|R
D
2
D
=1 mA
D
=32 µA
(one layer, 70 µm thick) copper area for drain
DS(on)max
DS
=5.5 A
GS
GS
=0 V
=0 V,
=0 V,
3)
,
min.
250
2
7
-
-
-
-
-
-
-
Values
typ.
146
0.1
2.1
10
14
3
1
BSZ16DN25NS3 G
-
-
-
max.
100
100
165
60
2
4
1
-
-
-
2010-09-01
Unit
K/W
V
µA
nA
m
S

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