GCM188R71H103KA37D Murata, GCM188R71H103KA37D Datasheet - Page 48

Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 0603 0.01uF 50volts X7R 10%

GCM188R71H103KA37D

Manufacturer Part Number
GCM188R71H103KA37D
Description
Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 0603 0.01uF 50volts X7R 10%
Manufacturer
Murata
Series
GCMr

Specifications of GCM188R71H103KA37D

Voltage Rating
50 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
X7R
Product
Automotive MLCCs
Dimensions
0.8 mm W x 1.6 mm L x 0.8 mm H
Termination Style
SMD/SMT
Capacitance
0.01 uF
Tolerance
10 %
Package / Case
0603 (1608 metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
GCM188R71H103KA37D
Manufacturer:
MURATA
Quantity:
640 000
Part Number:
GCM188R71H103KA37D
Manufacturer:
MURATA
Quantity:
32 000
Part Number:
GCM188R71H103KA37D 0603 X7R 103K 50V
Manufacturer:
MURATA/村田
Quantity:
20 000
2
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
4. Cleaning
5. Resin Coating
!Note
46
Notice
Please confirm there is no problem in the reliability of the
product beforehand when cleaning it with the intended
equipment.
The residue after cleaning it might cause the decrease in
the surface resistance of the chip and the corrosion of the
electrode part, etc. As a result it might cause reliability to
deteriorate. Please confirm beforehand that there is no
problem with the intended equipment in ultrasonic
cleansing.
Please use it after confirming there is no influence on the
product with a intended equipment beforehand when the
resin coating and molding.
A cracked chip might be caused at the cooling/heating
cycle by the amount of resin spreading and/or bias
thickness.
The resin for coating and molding must be selected as
the stress is small when stiffening and the hygroscopic is
low as possible.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C03E.pdf
09.3.31

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