HEF40106BP NXP Semiconductors, HEF40106BP Datasheet
HEF40106BP
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HEF40106BP Summary of contents
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... Astable multivibrators Monostable multivibrators 4. Ordering information Table 1. Ordering information All types operate from 40 C to +125 C Type number Package Name HEF40106BP DIP14 HEF40106BT SO14 HEF40106BTT TSSOP14 ). H power supply range referenced Description plastic dual in-line package; 14 leads (300 mil) plastic small outline package ...
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... NXP Semiconductors 5. Functional diagram mna204 Fig 1. Functional diagram 6. Pinning information 6.1 Pinning Fig 3. Pin configuration HEF40106B Product data sheet Fig 2. HEF40106B 001aal174 All information provided in this document is subject to legal disclaimers. Rev. 6 — 23 August 2011 HEF40106B Hex inverting Schmitt trigger A Logic diagram (one inverting buffer) ...
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... NXP Semiconductors 6.2 Pin description Table 2. Pin description Symbol Pin 11 10 Functional description [1] Table 3. Function table Input [ HIGH voltage level LOW voltage level. 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to V Symbol ...
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... NXP Semiconductors 9. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter V supply voltage DD V input voltage I T ambient temperature amb 10. Static characteristics Table 6. Static characteristics unless otherwise specified Symbol Parameter Conditions I < 1 A V HIGH-level OH O output voltage I < 1 A ...
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... NXP Semiconductors 11. Dynamic characteristics Table 7. Dynamic characteristics = 25 C; C 20 ns; wave forms see pF amb Symbol Parameter t HIGH to LOW PHL propagation delay t LOW to HIGH PLH propagation delay t HIGH to LOW output THL transition time t LOW to HIGH output TLH transition time [1] Typical value of the propagation delay and output transition time can be calculated with the extrapolation formula (C Table 8 ...
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... NXP Semiconductors 12. Waveforms Measurement points are given in Logic levels: V and input rise and fall times Fig 4. Propagation delay and output transition time Table 9. Measurement points Supply voltage Test data given in Table 10. Definitions for test circuit: DUT = Device Under Test load capacitance including jig and probe capacitance. ...
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... NXP Semiconductors 13. Transfer characteristics Table 11. Transfer characteristics see Figure 6 and Figure SS Symbol Parameter V positive-going threshold voltage T+ V negative-going threshold voltage T V hysteresis voltage C. [1] All typical values are at T amb T− Fig 6. Transfer characteristic HEF40106B Product data sheet 7. Conditions 001aag107 Fig 7. ...
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... NXP Semiconductors 100 I D (μ amb = 25 amb Fig 8. Typical drain current as a function of input HEF40106B Product data sheet 001aal181 (μ (V) I 2000 I D (μA) 1600 1200 800 400 All information provided in this document is subject to legal disclaimers. Rev. 6 — 23 August 2011 ...
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... NXP Semiconductors = 25 C. T amb Fig 9. Typical switching levels as a function of supply voltage 14. Application information Some examples of applications for the HEF40106B are: • Wave and pulse shapers • Astable multivibrators • Monostable multivibrators R C Fig 10. Astable multivibrator If a Schmitt trigger is driven via a high-impedance (R > 1 k), then it is necessary to incorporate a capacitor C with a value of on the edges of a pulse ...
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... NXP Semiconductors 15. Package outline DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors 16. Revision history Table 12. Revision history Document ID Release date HEF40106B v.6 20110823 • Modifications: Errata in pin configuration table corrected. HEF40106B v.5 20110511 • Modifications: HEF40106BTT (TSSOP14) added. HEF40106B v.4 20101115 HEF40106B_CNV v.3 19950101 HEF40106B_CNV v.2 19950101 HEF40106B Product data sheet ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 18. Contact information For more information, please visit: For sales office addresses, please send an email to: HEF40106B Product data sheet 17 ...
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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Transfer characteristics ...