AM29F200BT-70EF Spansion Inc., AM29F200BT-70EF Datasheet - Page 42

• Manufacturer Part Number: AM29F200BT-70EF
• Description: IC, FLASH, 2MBIT, 70NS, TSOP-48
• Manufacturer: Spansion Inc.

Specifications of AM29F200BT-70EF

• Memory Type: Flash
• Memory Size: 2Mbit
• Memory Configuration: 256K X 8 / 128K X 16
• Access Time: 70ns
• Supply Voltage Range: 4.5V To 5.5V
• Memory Case Style: TSOP
• No. Of Pins: 48
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

REVISION SUMMARY
Revision A (July 1998)
Global
Made formatting and layout consistent with other data
sheets. Used updated common tables and diagrams
Revision B (January 1999)
Distinctive Characteristics
Added bullet for 20-year data retention at 125°C
Ordering Information
Optional Processing : Deleted “B = Burn-in”.
DC Characteristics—TTL/NMOS Compatible
I
cations are tested with V
DC Characteristics—CMOS Compatible
I
cations are tested with V
AC Characteristics
Figure 15. Data# Polling Timings (During Embedded
Algorithms) : Added text to note.
Figure 16. Toggle Bit Timings (During Embedded Algo-
rithms) : Added text to note.
Revision B+2 (July 2, 1999)
Global
Added references to availability of device in Known
Good Die (KGD) form.
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable ( i.e., submersible repeater and artificial satellite). Please note that FASL will not be liable to you
and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices
have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures
into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating condi-
tions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Ex-
change and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior
authorization by the respective government entity will be required for export of those products.
Trademarks
Copyright © 2004 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
ExpressFlash is a trademark of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
42
CC1
CC1
, I
, I
CC2
CC2
, I
, I
CC3
CC3
: Added Note 2 “Maximum I
: Added Note 2 “Maximum I
CC
CC
= V
= V
CCmax
CCmax
”.
”.
CC
CC
specifi-
specifi-
Am29F200B
Revision C (November 12, 1999)
AC Characteristics—Figure 13. Program
Operations Timing and Figure 14. Chip/Sector
Erase Operations
Deleted t
high.
Physical Dimensions
Replaced figures with more detailed illustrations.
Revision D (November 29, 2000)
Added table of contents.
Ordering Information
Deleted burn-in option.
Revision D (November 29, 2000)
Added table of contents.
Ordering Information
Deleted burn-in option.
Revision D+1 (June 14, 2004)
Ordering Information
Added Pb-free OPNs.
GHWL
and changed OE# waveform to start at