IRF840APBF Vishay, IRF840APBF Datasheet - Page 2

N CHANNEL MOSFET, 500V, 8A, TO-220

IRF840APBF

Manufacturer Part Number
IRF840APBF
Description
N CHANNEL MOSFET, 500V, 8A, TO-220
Manufacturer
Vishay
Type
Power MOSFETr
Datasheets

Specifications of IRF840APBF

Transistor Polarity
N Channel
Continuous Drain Current Id
8A
Drain Source Voltage Vds
500V
On Resistance Rds(on)
850mohm
Rds(on) Test Voltage Vgs
10V
Threshold Voltage Vgs Typ
4V
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
850 mOhm @ 4.8A, 10V
Drain To Source Voltage (vdss)
500V
Current - Continuous Drain (id) @ 25° C
8A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
38nC @ 10V
Input Capacitance (ciss) @ Vds
1018pF @ 25V
Power - Max
125W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Minimum Operating Temperature
- 55 C
Configuration
Single
Resistance Drain-source Rds (on)
0.85 Ohm @ 10 V
Drain-source Breakdown Voltage
500 V
Gate-source Breakdown Voltage
+/- 30 V
Continuous Drain Current
8 A
Power Dissipation
125000 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Number Of Elements
1
Polarity
N
Channel Mode
Enhancement
Drain-source On-res
0.85Ohm
Drain-source On-volt
500V
Gate-source Voltage (max)
±30V
Operating Temp Range
-55C to 150C
Operating Temperature Classification
Military
Mounting
Through Hole
Pin Count
3 +Tab
Package Type
TO-220AB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
*IRF840APBF

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Avalanche Characteristics
Thermal Resistance
Diode Characteristics
Dynamic @ T
Document Number: 91065
Static @ T
E
I
E
R
R
R
R
g
Q
Q
Q
t
t
t
t
C
C
C
C
C
C
I
I
V
t
Q
t
V
∆V
V
I
I
AR
S
on
DSS
GSS
d(on)
d(off)
f
SM
r
rr
AS
AR
fs
θJC
θCS
θJA
DS(on)
SD
(BR)DSS
GS(th)
iss
oss
rss
oss
oss
oss
g
gs
gd
rr
(BR)DSS
eff.
/∆T
J
Breakdown Voltage Temp. Coefficient
Effective Output Capacitance
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) 
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
Drain-to-Source Breakdown Voltage
Static Drain-to-Source On-Resistance –––
Gate Threshold Voltage
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Forward Transconductance
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Output Capacitance
Output Capacitance
J
= 25°C (unless otherwise specified)
J
= 25°C (unless otherwise specified)
Single Pulse Avalanche Energy‚
Avalanche Current
Repetitive Avalanche Energy
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Parameter
Parameter
Parameter
Parameter
Parameter
–––
500
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Min. Typ. Max. Units
Min. Typ. Max. Units
Min. Typ. Max. Units
3.7
2.0
–––
–––
–––
–––
––– 2.16 3.24
Intrinsic turn-on time is negligible (turn-on is dominated by L
1018 –––
1490 –––
0.58
–––
–––
–––
–––
–––
–––
–––
–––
155
–––
–––
–––
422
––– 0.85
–––
––– -100
8.0
11
23
26
19
42
56
–––
633
–––
250
100
–––
–––
–––
–––
–––
–––
–––
–––
2.0
4.0
9.0
8.0
38
18
25
32
–––
µC
nC
ns
pF
µA
nA
ns
V/°C
S
V
V
V
Typ.
Typ.
0.50
–––
–––
–––
–––
ƒ = 1.0MHz, See Fig. 5
V
V
I
V
V
V
I
R
R
V
V
V
V
V
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
T
di/dt = 100A/µs „
V
V
V
V
V
V
D
D
J
J
GS
Reference to 25°C, I
GS
DS
DS
DS
GS
GS
DS
DS
GS
DD
GS
DS
GS
GS
GS
G
D
= 8.0A
= 8.0A
= 25°C, I
= 25°C, I
= 9.1Ω
= 31Ω,See Fig. 10
= 50V, I
= 400V
= 0V
= 25V
= 0V, I
= 10V, I
= V
= 500V, V
= 400V, V
= 30V
= -30V
= 10V, See Fig. 6 and 13 „
= 250V
= 0V, V
= 0V, V
= 0V, V
GS
, I
D
S
F
DS
D
D
D
DS
DS
= 250µA
Conditions
= 8.0A, V
= 8.0A
Conditions
Conditions
= 250µA
= 4.8A
= 4.8A „
GS
GS
= 0V to 400V …
Max.
Max.
= 1.0V, ƒ = 1.0MHz
= 400V, ƒ = 1.0MHz
510
–––
8.0
1.0
13
62
= 0V
= 0V, T
D
www.vishay.com
GS
= 1mA
J
G
= 0V „
= 125°C
Units
Units
°C/W
S
mJ
mJ
+L
A
D
S
D
)
2

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