ENW-C9A21A4EF Panasonic - ECG, ENW-C9A21A4EF Datasheet - Page 19

• Manufacturer Part Number: ENW-C9A21A4EF
• Description: RF MODULE 802.15.4 W/ANT SNAP
• Manufacturer: Panasonic - ECG
• Series: PAN4561r

Specifications of ENW-C9A21A4EF

• Frequency: 2.4GHz
• Data Rate - Maximum: 250kbps
• Modulation Or Protocol: 802.15.4
• Applications: General Purpose
• Power - Output: 0dBm
• Sensitivity: -92dBm
• Voltage - Supply: 2.7 V ~ 3.4 V
• Current - Receiving: 45mA
• Current - Transmitting: 43mA
• Data Interface: PCB, Surface Mount
• Memory Size: 60kB Flash, 4kB RAM
• Antenna Connector: On-Board, Chip
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Module
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ENW-C9A21A4EF; ENWC9A21A4EF; P14522TR; PAN4560; PAN4561L; Q5659594

CLASSIFICATION
SUBJECT
CUSTOMER’S CODE
PAN4561H /M /L
20. RECOMMENDED LAND PATTERN
PANASONIC ELECTRONIC DEVICES EUROPE GMBH
Dimensions in millimeters.
The land pattern dimensions above are meant to serve only as a guid. This information is
provided without any legal liability.
For the footprint, it is recommended to incorporate a 50µm bigger size for the pads in each
direction compared to the module footprint. Please refer to chapter 17. Foot Print of the Module.
For the solder paste screen, please use the same screen for the module. Solder paste screen
cutouts (with slightly different dimensions) might be optimum depending on your soldering
process For example, the chosen solder paste screen thickness might havean effect. The solder
screen thickness depends on your production standard. We recommend 120µm to 150µm.
IMPORTANT:
Although the bottom side of PAN4561 is fully coated, no copper such as through hole vias,
planes or tracks on the board component layer should be located below the PAN4561 to avoid
creating a short. In cases where a track or through hole via has to be located under the module,
please make a note that it has to be kept away from PAN4561 bottom pads. The PAN4561
multilayer pcb contains an inner RF shielding plane, therefore no pcb shielding plane below the
module is needed.
When using the antenna pad version, place the antenna on the edge of your carrier board (if
allowable).
If you have any questions on these points, please contact your local Panasonic representative.
Before releasing the layout, we recommend to sent the schematic and layout for final check to
[e-mail].
min. 5.0
MODEM FOR 802.15.4 IEEE STANDARD
53
1
PRODUCT SPECIFICATION
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
to use 50µm bigger pad size to each direction!
In comparison to the module, we recommend
Pad 1 = 4 x 1.40mm x 1.40mm
Pad 2 = 58 x 0.70mm x 1.40mm
35.0 mm
28.35
No.
DS-4561-2400-102
PAGE
DATE
www.pedeu.pansonic.de
06.08.2010
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