SFELF10M7FA00-A0 Murata, SFELF10M7FA00-A0 Datasheet - Page 101

• Manufacturer Part Number: SFELF10M7FA00-A0
• Description: Signal Conditioning 280KHz
• Manufacturer: Murata

Specifications of SFELF10M7FA00-A0

• Rad Hardened: No
• Product: Ceramic Filters
• Lead Free Status / RoHS Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. The component mounted on the PCB may be damaged if
2. Layout the components on the PCB to minimize the
3. After installing components, if solder is excessively
4. The component may be damaged during mounting
5. When correcting component's position with a soldering
6. Do not clean or wash the component as it is not
7. In case of overcoating the part, coating conditions such
8. Accurate test circuit values are required to measure
9. For safety purposes, avoid applying a direct current
1. Do not use this product with bend. The component
2. The component may be damaged when an excessive
3. All kinds of re-flow soldering must not be applied
4. Do not clean or wash the component as it is not
5. Do not use strong acidity flux, more than 0.2wt%
may be damaged if excess mechanical stress is
applied to it mounted on the printed circuit board.
stress is applied.
on the component.
hermetically sealed.
chlorine content, in flow soldering.
Ceramic Discriminator 10.7MHz Chip Type
Ceramic Discriminator 10.7MHz Lead Type
excess mechanical stress is applied.
stress imposed on the warp or flexure of the board.
applied to the circuit board, mechanical stress will cause
destruction resistance characteristics to lower. To prevent
this, be extremely careful in determining shape and
dimension before designing the circuit board diagram.
process if some part of mounter such as positioning
claws or nozzle are worn down. The regular maintenance
recommended for mounters should be done to prevent
troubles.
iron, the tip of the soldering iron should not directly touch
the chip component. Depending on the soldering
conditions, the effective area of terminations may be
reduced. The use of solder containing Ag should be
considered to prevent the electrode erosion.
hermetically sealed.
as material of resin, curing temperature, and so on
should be evaluated carefully.
electrical characteristics.
It may be a cause of miscorrelation if there is any
deviation, especially stray capacitance, from the test
circuit in the specification.
between the terminals.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
6. In case of covering discriminator with over coat,
7. Accurate test circuit values are required to
8. For safety purposes, avoid applying a direct
conditions such as material of resin, cure
temperature, and so on should be evaluated
carefully.
measure electrical characteristics. It may be a
cause of miscorrelation if there is any deviation,
especially stray capacitance, from the test
circuit in the specification.
current between the terminals.
[Component direction]
[Component layout close to board]
Perforation
A
Slit
B
C
Notice (Handling)
Susceptibility to
stress is in the order
of : A>C>B
Put the
component
laterally to the
direction in
which stress
acts.
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