SFELF10M7FA00-A0 Murata, SFELF10M7FA00-A0 Datasheet - Page 95

• Manufacturer Part Number: SFELF10M7FA00-A0
• Description: Signal Conditioning 280KHz
• Manufacturer: Murata

Specifications of SFELF10M7FA00-A0

• Rad Hardened: No
• Product: Ceramic Filters
• Lead Free Status / RoHS Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. The component will be damaged when an excessive
2. The component may be damaged if excess mechanical
3. Design layout of components on the PC board to
4. After installing chips, if solder is excessively applied to
5. The component may be damaged during mounting
6. The component is recommended with placement
7. When correcting chips with a soldering iron, the tip of the
8. Do not clean or wash the component as it is not
9. In case of covering filter with over coat, conditions such
10. Do not use strong acidity flux, more than 0.2wt%
11. Accurate test circuit values are required to measure
12. The components, packed in the moisture proof bag (dry
13. For safety purposes, connect the output of filters to the
CERAFILr 10.7MHz Chip Type SFECF Series
stress is applied.
stress is applied to it mounted on the printed circuit
board.
minimize the stress imposed on the warp or flexure of the
board.
the circuit board, mechanical stress will cause destruction
resistance characteristics to lower. To prevent this, be
extremely careful in determining shape and dimension
before designing the circuit board diagram.
process if some part of mounter such as positioning
claws or nozzle are worn down. The regular maintenance
recommended for mounters should be done to prevent
troubles.
machines which employ optical placement capabilities.
The component might be damaged by excessive
mechanical force. Please make sure that you have
evaluated by using placement machines before going into
mass production. Do not use placement machines which
utilize mechanical positioning. Please contact Murata for
details beforehand.
soldering iron should not directly touch the chip
component. Depending on the soldering conditions, the
effective area of terminations may be reduced. The use
of solder containing Ag should be done to prevent the
electrode erosion.
hermetically sealed.
as material of resin, cure temperature, and so on should
be evaluated carefully.
chlorine content, in re-flow soldering.
electrical characteristics.
It may be a cause of miscorrelation if there is any
deviation, especially stray capacitance, from the test
circuit in the specification.
pack), are sensitive to moisture. The following treatment
is required before applying re-flow soldering. To avoid
reliability degradation caused by thermal stress, when
unpacked, store the component in an atmosphere at
30 C and below 60%R.H., and solder within 1 week.
IF amplifier through a D.C. blocking capacitor. Avoid
applying a direct current to the output of ceramic filters.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
[Component layout close to board]
Perforation
A
Slit
B
C
Notice (Handling)
Continued on the following page.
Susceptibility to
stress is in the order
of : A>C>B
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