SFELF10M7FA00-A0 Murata, SFELF10M7FA00-A0 Datasheet - Page 96

• Manufacturer Part Number: SFELF10M7FA00-A0
• Description: Signal Conditioning 280KHz
• Manufacturer: Murata

Specifications of SFELF10M7FA00-A0

• Rad Hardened: No
• Product: Ceramic Filters
• Lead Free Status / RoHS Status: Compliant

27
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. The component will be damaged when an excessive
2. The component may be damaged if excess mechanical
3. Design layout of components on the PC board to
4. After installing chips, if solder is excessively applied to
5. The component may be damaged during mounting
6. The component is recommended with placement
7. When correcting chips with a soldering iron, the tip of the
8. Do not clean or wash the component as it is not
9. In case of covering filter with over coat, conditions such
10. Do not use strong acidity flux, more than 0.2wt%
11. Accurate test circuit values are required to measure
94
12. For safety purposes, connect the output of filters to the
Notice (Handling)
CERAFILr 10.7MHz Chip Type SFECV Series
stress is applied.
stress is applied to it mounted on the printed circuit
board.
minimize the stress imposed on the warp or flexure of the
board.
the circuit board, mechanical stress will cause
destruction resistance characteristics to lower. To
prevent this, be extremely careful in determining shape
and dimension before designing the circuit board
diagram.
process if some part of mounter such as positioning
claws or nozzle are worn down. The regular maintenance
recommended for mounters should be done to prevent
troubles.
machines which employ optical placement capabilities.
The component might be damaged by excessive
mechanical force. Please make sure that you have
evaluated by using placement machines before going
into mass production. Do not use placement machines
which utilize mechanical positioning. Please contact
Murata for details beforehand.
soldering iron should not directly touch the chip
component. Depending on the soldering conditions, the
effective area of terminations may be reduced. The use
of solder containing Ag should be done to prevent the
electrode erosion.
hermetically sealed.
as material of resin, cure temperature, and so on should
be evaluated carefully.
Continued from the preceding page.
chlorine content, in re-flow soldering.
electrical characteristics. It may be a cause of mis-
correlation if there is any deviation, especially stray
capacitance, from the test circuit in the specification.
IF amplifier through a D.C. blocking capacitor. Avoid
applying a direct current to the output of ceramic filters.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
[Component direction]
[Component layout close to board]
Perforation
A
Slit
B
C
Susceptibility to
stress is in the order
of : A>C>B
Put the
component
lateral to the
direction in
which stress
acts.
P50E.pdf
08.1.29