SFELF10M7FA00-A0 Murata, SFELF10M7FA00-A0 Datasheet - Page 98

• Manufacturer Part Number: SFELF10M7FA00-A0
• Description: Signal Conditioning 280KHz
• Manufacturer: Murata

Specifications of SFELF10M7FA00-A0

• Rad Hardened: No
• Product: Ceramic Filters
• Lead Free Status / RoHS Status: Compliant

27
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
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96
Notice (Handling)
CERAFILr 2.3-5.7MHz Chip Type SFSKB Series
The component will be damaged when an excessive
stress is applied.
The component may be damaged if excess mechanical
stress is applied to it mounted on the printed circuit
board.
Design layout of components on the PC board to
minimize the stress imposed on the warp or flexure of the
board.
After installing chips, if solder is excessively applied to
the circuit board, mechanical stress will cause destruction
resistance characteristics to lower. To prevent this, be
extremely careful in determining shape and dimension
before designing the circuit board diagram.
The component may be damaged during mounting
process if some part of mounter such as positioning
claws, nozzle are worn down. The regular maintenance
recommended for mounters should be done to prevent
the troubles.
The component is recommended with placement
machines which employ optical placement capabilities.
The component might be damaged by excessive
mechanical force. Please make sure that you have
evaluated by using placement machines before going into
mass production. Do not use placement machines which
utilize mechanical positioning. Please contact Murata for
details beforehand.
When correcting chips with a soldering iron, the tip of the
soldering iron should not directly touch the chip
component. Depending on the soldering conditions, the
effective area of terminations may be reduced. The use of
solder containing Ag should be done to prevent the
electrode erosion.
Do not clean or wash the component as it is not
hermetically sealed.
In case of covering filter with over coat, conditions such
as material of resin, cure temperature, and so on should
be evaluated carefully.
Continued from the preceding page.
Do not use strong acidity flux, more than 0.2wt%
chlorine content, in re-flow soldering.
Accurate test circuit values are required to measure
electrical characteristics. It may be a cause of
miscorrelation if there is any deviation, especially stray
capacitance, from the test circuit in the specification.
For safety purposes, connect the output of filters to the
IF amplifier through a D.C. blocking capacitor. Avoid
applying a direct current to the output of ceramic filters.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
[Component layout close to board]
[Component direction]
Perforation
A
Slit
B
C
Susceptibility to
stress is in the order
of : A>C>B
Put the compon-
ent laterally to
the direction in
which stress
acts.
P50E.pdf
08.1.29