IDP09E60 Infineon Technologies, IDP09E60 Datasheet

Diodes (General Purpose, Power, Switching) FAST SWITCH EMCON DIODE 600V 9A

IDP09E60

Manufacturer Part Number
IDP09E60
Description
Diodes (General Purpose, Power, Switching) FAST SWITCH EMCON DIODE 600V 9A
Manufacturer
Infineon Technologies
Datasheet

Specifications of IDP09E60

Product
Power Diodes
Peak Reverse Voltage
600 V
Forward Continuous Current
9 A
Max Surge Current
40 A
Configuration
Single
Recovery Time
75 ns
Forward Voltage Drop
2 V
Maximum Reverse Leakage Current
50 uA
Maximum Power Dissipation
57.7 W
Operating Temperature Range
- 55 C to + 175 C
Maximum Operating Temperature
+ 175 C
Minimum Operating Temperature
- 55 C
Mounting Style
Through Hole
Package / Case
TO-220-2
Packages
PG-TO220-2
If (typ)
9.0 A
If (max)
19.3 A
If,sm (max)
40.0 A
Vf (typ)
1.5 V
Ir (max)
50.0 µA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IDP09E60
Manufacturer:
INFINEON
Quantity:
12 500
Part Number:
IDP09E60
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Fast Switching EmCon Diode
Type
IDP09E60
IDB09E60
Maximum Ratings, at T
Parameter
Repetitive peak reverse voltage
Continous forward current
T
T
Surge non repetitive forward current
T
Maximum repetitive forward current
T
Power dissipation
T
T
Operating and storage temperature
Soldering temperature
1.6mm(0.063 in.) from case for 10s
Rev.2
Feature
• 600 V EmCon technology
• Fast recovery
• Soft switching
• Low reverse recovery charge
• Low forward voltage
• 175°C operating temperature
• Easy paralleling
C
C
C
C
C
C
=25°C
=90°C
=25°C, t
=25°C, t
=25°C
=90°C
p
p
=10 ms, sine halfwave
limited by T
Package
P-TO220-2-2.
P-TO220-3.SMD Q67040-S4482
jmax
, D=0.5
j
= 25 °C, unless otherwise specified
Ordering Code
Q67040-S4483
Page 1
Symbol
V
I
I
I
P
T
T
F
FSM
FRM
j ,
S
RRM
tot
T
stg
P-TO220-3.SMD
Marking
D09E60
D09E60
Product Summary
V
I
V
T
F
RRM
F
jmax
-55...+175
Pin 1
NC
Value
C
19.3
29.5
57.7
32.7
600
255
13
40
P-TO220-2-2.
PIN 2
C
A
2003-07-31
IDB09E60
IDP09E60
600
175
1.5
9
PIN 3
Unit
V
A
W
°C
°C
A
-
°C
V
A
V

Related parts for IDP09E60

IDP09E60 Summary of contents

Page 1

... Symbol FSM I FRM Page 1 Product Summary V RRM jmax P-TO220-3.SMD P-TO220-2-2. Marking Pin 1 PIN 2 C D09E60 D09E60 NC Value 600 RRM 19 29.5 tot 57.7 32.7 -55...+175 T stg 255 IDP09E60 IDB09E60 600 1.5 V 175 °C PIN Unit °C °C 2003-07-31 ...

Page 2

... Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. Rev.2 Symbol R thJC R thJA R thJA = 25 °C, unless otherwise specified j Symbol Page 2 IDP09E60 IDB09E60 Values Unit min. typ. max 2.6 K ...

Page 3

... Symbol t rr =25°C j =125°C j =150° rrm =25°C j =125°C j =150° =25°C j =125°C j =150° =25°C j =125°C j =150°C j Page 3 IDP09E60 IDB09E60 Values Unit min. typ. max 110 - - 112 - 343 - - 585 - - ...

Page 4

... Rev.2 2 Diode forward current I = f(T F parameter 125 °C 175 Typ. diode forward voltage 1.6 1.4 1.2 1 Page ≤ 175° 100 125 ) j 2 18A 9A 4,5A 1 -60 - IDP09E60 IDB09E60 °C 175 T C 100 °C 160 T j 2003-07-31 ...

Page 5

... V 700 800 A/µs 1000 di /dt F Page 5 /dt 400V 125 ° 18A 9A 4.5A 200 300 400 500 600 700 /dt 400V 125° 200 300 400 500 600 700 IDP09E60 IDB09E60 800 A/µs 1000 di /dt F 18A 9A 4.5A 800 A/µs 1000 di /dt F 2003-07-31 ...

Page 6

... Max. transient thermal impedance thJC p parameter : IDP09E60 10 K single pulse - Rev 0.50 0.20 0.10 0.05 0.02 0. Page 6 IDP09E60 IDB09E60 2003-07-31 ...

Page 7

... Rev symbol Page 7 IDP09E60 IDB09E60 TO-220-2-2 dimensions [mm] [inch] min max min max A 9.70 10.10 0.3819 0.3976 B 15.30 15.90 0.6024 0.6260 C 0.65 0.85 0.0256 0.0335 D 3.55 3.85 0.1398 0.1516 E 2.60 3.00 0.1024 0.1181 F 9.00 9.40 0.3543 0.3701 G 13.00 14.00 0.5118 0.5512 H 17.20 17 ...

Page 8

... R S 1.70 2.50 T 0.50 0.65 10.8 typ. U 1.35 typ. V 6.43 typ. W 4.60 typ. X 9.40 typ. Y 16.15 typ. Z Page 8 IDP09E60 IDB09E60 [inch] min max 0.3858 0.3937 0.0512 typ. 0.0492 0.0689 0.0374 0.0453 0.1 typ. 0.0283 0.0335 0.2 typ. 0.1693 0.1772 0.0504 0.0551 ...

Page 9

... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev.2 Page 9 IDP09E60 IDB09E60 2003-07-31 ...

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