AD976AR Analog Devices Inc, AD976AR Datasheet - Page 5

• Manufacturer Part Number: AD976AR
• Description: A/D Converter (A-D) IC
• Manufacturer: Analog Devices Inc

Specifications of AD976AR

• Package/case: 28-SOIC
• Features: 16?Bit, Serial, 100kSPS ADC
• Interface Type: Parallel
• Leaded Process Compatible: No
• Number Of Bits: 16
• Number Of Channels: 1
• Peak Reflow Compatible (260 C): No
• Rohs Status: RoHS non-compliant
• Sampling Rate (per Second): 200k
• Data Interface: Parallel
• Number Of Converters: 1
• Power Dissipation (max): 100mW
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (0.300", 7.50mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• For Use With: EVAL-AD976CB - BOARD EVAL FOR AD976EVAL-AD976ACB - BOARD EVAL FOR AD976A
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

ABSOLUTE MAXIMUM RATINGS
Analog Inputs
Ground Voltage Differences
Supply Voltages
Digital Inputs . . . . . . . . . . . . . . . . . . . –0.3 V to V
Internal Power Dissipation
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 C
Storage Temperature Range (N, R, RS) . . . –65 C to +150 C
Lead Temperature Range
NOTES
1
2
Model
AD976AN
AD976BN
AD976CN
AD976AAN
AD976ABN
AD976ACN
AD976AR
AD976BR
AD976CR
AD976AAR
AD976ABR
AD976ACR
AD976ARS
AD976BRS
AD976CRS
AD976AARS
AD976ABRS
AD976ACRS
REV. C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD976/AD976A features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Specification is for device in free air:
28-Lead PDIP:
28-Lead SOIC:
28-Lead SSOP:
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
V
CAP . . . . . . . . . . . . . . . . +V
REF . . . . . . . . . . . . . . . . . . . . . Indefinite Short to AGND2
DGND, AGND1, AGND2 . . . . . . . . . . . . . . . . . . . . 0.3 V
V
V
V
PDIP (N), SOIC (R), SSOP (RS) . . . . . . . . . . . . . 700 mW
(Soldering 10 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +300 C
IN
ANA
DIG
DIG
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
to V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
ANA
JA
JA
JA
= 74 C/W;
= 72 C/W;
= 109 C/W;
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Temperature
Range
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
JC
2
JC
JC
= 24 C/W,
= 23 C/W,
= 39 C/W.
ANA
+ 0.3 V to AGND2 – 0.3 V
1
Max
INL
3.0 LSB
2.0 LSB
3.0 LSB
2.0 LSB
3.0 LSB
2.0 LSB
3.0 LSB
2.0 LSB
3.0 LSB
2.0 LSB
3.0 LSB
2.0 LSB
Min
S/(N+D)
83 dB
85 dB
83 dB
83 dB
85 dB
83 dB
83 dB
85 dB
83 dB
83 dB
85 dB
83 dB
83 dB
85 dB
83 dB
83 dB
85 dB
83 dB
DIG
ORDERING GUIDE
+ 0.3 V
25 V
7 V
–5–
Throughput
Rate
100 kSPS
100 kSPS
100 kSPS
200 kSPS
200 kSPS
200 kSPS
100 kSPS
100 kSPS
100 kSPS
200 kSPS
200 kSPS
200 kSPS
100 kSPS
100 kSPS
100 kSPS
200 kSPS
200 kSPS
200 kSPS
Figure 1. Load Circuit for Digital Interface Timing
OUTPUT
Package
Descriptions
28-Lead, 300 mil Plastic DIP
28-Lead, 300 mil Plastic DIP
28-Lead, 300 mil Plastic DIP
28-Lead, 300 mil Plastic DIP
28-Lead, 300 mil Plastic DIP
28-Lead, 300 mil Plastic DIP
28-Lead Small Outline Package
28-Lead Small Outline Package
28-Lead Small Outline Package
28-Lead Small Outline Package
28-Lead Small Outline Package
28-Lead Small Outline Package
28-Lead Shrink Small Outline Package RS-28
28-Lead Shrink Small Outline Package RS-28
28-Lead Shrink Small Outline Package RS-28
28-Lead Shrink Small Outline Package RS-28
28-Lead Shrink Small Outline Package RS-28
28-Lead Shrink Small Outline Package RS-28
PIN
TO
DIP, SOIC and SSOP Packages
D15 (MSB)
AGND2
AGND1
100pF
DGND
PIN CONFIGURATION
CAP
REF
D14
D13
D12
D11
D10
V
C
D9
D8
IN
L
10
11
12
13
14
1
2
3
4
5
6
7
8
9
500 A
1.6mA
(Not to Scale)
TOP VIEW
AD976A
AD976
I
I
OL
OH
WARNING!
AD976/AD976A
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
BUSY
R/C
BYTE
D0 (LSB)
D1
D2
D3
D4
D5
D6
D7
V
CS
DIG
ANA
+2.1V
ESD SENSITIVE DEVICE
Package
Options
N-28B
N-28B
N-28B
N-28B
N-28B
N-28B
R-28
R-28
R-28
R-28
R-28
R-28