DSPIC33FJ64GP706AT-I/MR Microchip Technology, DSPIC33FJ64GP706AT-I/MR Datasheet - Page 327

• Manufacturer Part Number: DSPIC33FJ64GP706AT-I/MR
• Description: 16 Bit MCU/DSP 40MIPS 64KB FLASH 64 QFN 9x9x0.9mm T/R
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ64GP706AT-I/MR

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 53
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 18x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-VFQFN, Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

 2009 Microchip Technology Inc.
100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
c
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
b
e
β
N
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
1 2 3
dsPIC33FJXXXGPX06A/X08A/X10A
D
D1
Dimension Limits
Preliminary
NOTE 2
E1
φ
L
Units
A2
A1
E1
D1
L1
N
D
A
E
α
e
L
φ
c
b
β
E
A1
A
0.95
0.05
0.45
0.09
0.17
MIN
11°
11°
0°
–
L1
MILLIMETERS
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
0.50 BSC
1.00 REF
NOM
1.00
0.60
0.22
3.5°
100
12°
12°
–
–
–
Microchip Technology Drawing C04-110B
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
DS70593B-page 327
A2
α