SIDC02D60C6 Infineon Technologies, SIDC02D60C6 Datasheet
SIDC02D60C6
Specifications of SIDC02D60C6
Related parts for SIDC02D60C6
SIDC02D60C6 Summary of contents
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... Die Size 1.4 x 1.65 mm 0.98 x 1.23 suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIDC02D60C6 A C Package sawn on foil 1.4 x 1.65 2.31 / 1.31 70 150 180 ...
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... ° = °C j di/dt=800A ° =300V ° = °C j di/dt=800A ° =300V ° SIDC02D60C6 Value Unit 600 -40...+175 C Value Unit min. Typ. max. 27 µA 600 V 1.25 1.6 1. Value Unit min. Typ. max. 10.5 11.5 A 12.0 0.35 0.60 µC 0.70 0.065 0.12 mJ 0.16 ...
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... CHIP DRAWING: Edited by INFINEON Technologies, AIM PMD D CID CLS, L4991M, Edition 1.1, 10.07.2006 SIDC02D60C6 ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies, AIM PMD D CID CLS, L4991M, Edition 1.1, 10.07.2006 SIDC02D60C6 FS6R06VE3 ...