SIDC03D60F6 Infineon Technologies, SIDC03D60F6 Datasheet
SIDC03D60F6
Specifications of SIDC03D60F6
SP000272343
Related parts for SIDC03D60F6
SIDC03D60F6 Summary of contents
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... Die Size 1.2 x 2.25 mm suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIDC03D60F6 A C Package Ordering Code Q67050-A4037- sawn on foil A001 1.2 x 2.25 2.7 / 1.45 1 ...
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... C, unless otherwise specified, tested at component j Conditions I = ° di/dt=550A ° =400V ° di/dt=550A ° = di/dt=550A =6A / di/dt=550A di/dt=550A SIDC03D60F6 Value Unit 600 tbd 12 -55...+150 C Value Unit min. Typ. max. 27 µA 600 V 1.45 V Value Unit min. Typ. max 105 6.5 A 7.9 240 n C 400 tbd 4.9 ...
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... CHIP DRAWING: Edited by INFINEON Technologies HV3, L 4324M, Edition 2, 14.05.2003 Preliminary SIDC03D60F6 ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, L 4324M, Edition 2, 14.05.2003 Preliminary SIDC03D60F6 INFINEON TECHNOLOGIES / EUPEC tbd ...