NTD3055-094T4G ON Semiconductor, NTD3055-094T4G Datasheet - Page 8

MOSFET N-CH 60V 12A DPAK

NTD3055-094T4G

Manufacturer Part Number
NTD3055-094T4G
Description
MOSFET N-CH 60V 12A DPAK
Manufacturer
ON Semiconductor
Type
Power MOSFETr
Datasheet

Specifications of NTD3055-094T4G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
94 mOhm @ 6A, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
12A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
20nC @ 10V
Input Capacitance (ciss) @ Vds
450pF @ 25V
Power - Max
1.5W
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.094 Ohm @ 10 V
Forward Transconductance Gfs (max / Min)
6.7 S
Drain-source Breakdown Voltage
60 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
12 A
Power Dissipation
48000 mW
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Number Of Elements
1
Polarity
N
Channel Mode
Enhancement
Drain-source On-res
0.094Ohm
Drain-source On-volt
60V
Gate-source Voltage (max)
±20V
Drain Current (max)
12A
Output Power (max)
Not RequiredW
Frequency (max)
Not RequiredMHz
Noise Figure
Not RequireddB
Power Gain
Not RequireddB
Drain Efficiency
Not Required%
Operating Temp Range
-55C to 175C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
2 +Tab
Package Type
DPAK
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NTD3055-094T4GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTD3055-094T4G
Manufacturer:
ON
Quantity:
12 500
Part Number:
NTD3055-094T4G
Manufacturer:
ON SEMICONDUCTOR
Quantity:
30 000
Part Number:
NTD3055-094T4G
Manufacturer:
ON/安森美
Quantity:
20 000
Part Number:
NTD3055-094T4G
0
Company:
Part Number:
NTD3055-094T4G
Quantity:
12 500
Company:
Part Number:
NTD3055-094T4G
Quantity:
450
V
S
F
1
B
R
G
4
2
3
L
K
A
D
2 PL
0.13 (0.005)
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
H
0.228
J
5.80
M
C
T
−T−
SOLDERING FOOTPRINT*
PACKAGE DIMENSIONS
E
0.244
6.20
SEATING
PLANE
U
http://onsemi.com
CASE 369C−01
ISSUE C
DPAK
0.101
2.58
8
0.118
3.0
0.063
1.6
SCALE 3:1
6.172
0.243
Z
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING
2. CONTROLLING DIMENSION: INCH.
PER ANSI Y14.5M, 1982.
STYLE 2:
DIM
A
B
C
D
G
H
K
R
U
E
F
J
L
S
V
Z
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
0.235
0.250
0.086
0.027
0.018
0.037
0.034
0.018
0.102
0.180
0.025
0.020
0.035
0.155
MIN
0.180 BSC
0.090 BSC
INCHES
0.245
0.265
0.094
0.035
0.023
0.045
0.040
0.023
0.215
0.040
0.050
0.114
MAX
−−−
−−−
MILLIMETERS
5.97
6.35
2.19
0.69
0.46
0.94
0.87
0.46
2.60
4.57
0.63
0.51
0.89
3.93
MIN
4.58 BSC
2.29 BSC
MAX
6.22
6.73
2.38
0.88
0.58
1.14
1.01
0.58
2.89
5.45
1.01
1.27
−−−
−−−

Related parts for NTD3055-094T4G