IRF7526D1PBF International Rectifier, IRF7526D1PBF Datasheet

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IRF7526D1PBF

Manufacturer Part Number
IRF7526D1PBF
Description
MOSFET P-CH 30V 2A MICRO8
Manufacturer
International Rectifier
Series
FETKY™r
Datasheet

Specifications of IRF7526D1PBF

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Diode (Isolated)
Rds On (max) @ Id, Vgs
200 mOhm @ 1.2A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
2A
Vgs(th) (max) @ Id
1V @ 250µA
Gate Charge (qg) @ Vgs
11nC @ 10V
Input Capacitance (ciss) @ Vds
180pF @ 25V
Power - Max
1.25W
Mounting Type
Surface Mount
Package / Case
Micro8™
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
400 mOhms
Drain-source Breakdown Voltage
- 30 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
- 2 A
Power Dissipation
0.8 W
Gate Charge Qg
7.5 nC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
l
l
l
l
l
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The FETKY
designer an innovative board space saving solution for switching regulator
applications. Generation 5 HEXFETs utilize advanced processing techniques to
achieve extremely low on-resistance per silicon area. Combining this technology
with International Rectifier's low forward drop Schottky rectifiers results in an
extremely efficient device suitable for use in a wide variety of portable electronics
applications like cell phone, PDA, etc.
The new Micro8
the smallest footprint available in an SOIC outline. This makes the Micro8
device for applications where printed circuit board space is at a premium. The low
profile (<1.1mm) of the Micro8
environments such as portable electronics and PCMCIA cards.
Absolute Maximum Ratings
Thermal Resistance Ratings
Notes:

ƒ
Description
www.irf.com
Parameter
R
I
I
I
P
P
V
dv/dt
T
D
D
DM
θJA
Co-packaged HEXFET
MOSFET and Schottky Diode
P-Channel HEXFET
Generation 5 Technology
Micro8
D
D
GS
J,
Lead-Free
Pulse width ≤ 300µs – duty cycle ≤ 2%
Low V
Repetitive rating – pulse width limited by max. junction temperature (see Fig. 9)
I
@ T
@ T
SD
When mounted on 1 inch square copper board to approximate typical multi-layer PCB thermal resistance
T
@T
@T
STG
≤ -1.2A, di/dt ≤ 160A/µs, V
A
A
A
A
= 25°C
= 70°C
= 25°C
= 70°C
F
TM
TM
Schottky Rectifier
Footprint
TM
family of co-packaged HEXFETs and Schottky diodes offer the
package, with half the footprint area of the standard SO-8, provides
Parameter
Continuous Drain Current, V
Pulsed Drain Current À
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt Á
Junction and Storage Temperature Range
TM
Junction-to-Ambient
DD
®
will allow it to fit easily into extremely thin application
≤ V
Power
(BR)DSS
, T
J
≤ 150°C
Ã
GS
G
A
S
A
@ -4.5V
FETKY
1
2
3
4
Top View
IRF7526D1PbF
TM
TM
MOSFET & Schottky Diode
an ideal
8
7
6
5
-55 to +150
Maximum
Maximum
1.25
± 20
-2.0
-1.6
-5.0
K
-16
K
D
D
0.8
10
100
Schottky Vf = 0.39V
R
DS(on)
V
DSS
Micro8
= -30V
= 0.20Ω
TM
Units
mW/°C
°C/W
Units
V/ns
W
°C
A
V
1

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IRF7526D1PBF Summary of contents

Page 1

... Repetitive rating – pulse width limited by max. junction temperature (see Fig. 9) ‚ ≤ -1.2A, di/dt ≤ 160A/µs, V ≤ ƒ Pulse width ≤ 300µs – duty cycle ≤ 2% „ When mounted on 1 inch square copper board to approximate typical multi-layer PCB thermal resistance www.irf.com IRF7526D1PbF FETKY Power Top View @ -4 ...

Page 2

... IRF7526D1PbF MOSFET Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs DSS Gate-to-Source Forward Leakage GSS Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge gs Q Gate-to-Drain ("Miller") Charge gd t Turn-On Delay Time d(on) t Rise Time ...

Page 3

... Power Mosfet Characteristics 10 TOP BOTTOM - 3. 0.1 10 0.1 Fig 2. Typical Output Characteristics 2 -1.2A D 1.5 1.0 0.5 = -10V 0.0 A -60 -40 6.0 6.5 7.0 Fig 4. Normalized On-Resistance IRF7526D1PbF VGS - 15V - 10V - 7.0V - 5.5V - 4.5V - 4.0V - 3.5V -3.0V 20µs PULSE WIDTH T = 150° Drain-to-Source Voltage ( -10V GS - 100 120 140 160 T , Junction Temperature (° ...

Page 4

... IRF7526D1PbF 400 1MHz iss rss oss ds gd 300 C iss C oss 200 C rss 100 Drain-to-Source Voltage (V) DS Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 150° 25°C J 0.1 0.4 0.6 0.8 1 Source-to-Drain Voltage (V) SD Fig 7. Typical Source-Drain Diode Forward Voltage 4 Power Mosfet Characteristics ...

Page 5

... VGS = -4.5V 0.5 VGS = -10V 0 Drain Current (A) D Fig 10. Typical On-Resistance Vs. Drain Current www.irf.com Power Mosfet Characteristics 0.01 0 Rectangular Pulse Duration (sec) 1 0.60 0.50 0.40 0.30 0.20 0. Fig 11. Typical On-Resistance Vs. Gate IRF7526D1PbF Notes: 1. Duty factor Peak thJC -2. Gate-to-Source Voltage (V) GS Voltage ...

Page 6

... IRF7526D1PbF Schottky Diode Characteristics 10 1 0.1 0.0 0.2 0.4 Forward Voltage Drop - V Forward Voltage Drop - V Fig. 12 -Typical Forward Voltage Drop Characteristics 6 100 10 0.1 0.01 0.001 0.0001 T = 150° 125° 25°C J 160 140 120 100 0.6 0.8 1.0 ( (V) F Fig.14 - Maximum Allowable Ambient T = 150° ...

Page 7

... Fig 15a. Basic Gate Charge Waveform Fig 16a. Switching Time Test Circuit V GS 10% 90 Fig 16b. Switching Time Waveforms www.irf.com Current Regulator Same Type as D.U.T. .2µF 12V V GS Fig 15b. Gate Charge Test Circuit - + d(on) r d(off) f IRF7526D1PbF 50KΩ .3µ D.U.T. + -3mA Current Sampling Resistors 7 ...

Page 8

... IRF7526D1PbF + - + - • • • Driver Gate Drive Period P.W. D.U.T. I Waveform SD Reverse Recovery Body Diode Forward Current D.U.T. V Waveform DS Re-Applied Voltage Body Diode Inductor Curent Ripple ≤ Fig 8 • • • P. Period V GS Current di/dt Diode Recovery dv/ Forward Drop =10V www.irf.com ...

Page 9

... P = DES IGNAT ES LEAD - FREE PRODUCT (OPT IONAL (27-52) IF PRECEDED BY A LET TER W YEAR A 2001 B 2002 C 2003 D 2004 2005 2006 2007 2008 X 2009 Y 2010 Z IRF7526D1PbF INCHES MILLIMETERS DIM MIN MAX MIN MAX A .036 .044 0.91 1.11 A1 .004 .008 0.10 0.20 B .010 .014 0.25 ...

Page 10

... IRF7526D1PbF Micro8 Tape & Reel Information Dimensions are shown in millimeters (inches) TERMINAL NUMBER 1 8.1 ( .318 ) 7.9 ( .312 ) NOTES: 1. OUTLINE CONFORMS TO EIA-481 & EIA-541. 2. CONTROLLING DIMENSION : MILLIMETER. 330.00 (12.992) MAX. NOTES : 1. CONTROLLING DIMENSION : MILLIMETER. 2. OUTLINE CONFORMS TO EIA-481 & EIA-541. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 ...

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