SPD50P03L Infineon Technologies, SPD50P03L Datasheet
SPD50P03L
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SPD50P03L Summary of contents
Page 1
... Marking Q67042-S4076 50P03L SP000086729 50P03L Symbol Conditions =25 ° =100 ° =25 °C D,pulse =- = =- = /dt di /dt =-200 A/µs, T =175 °C j,max =25 °C tot stg page 1 SPD50P03L - -50 A P-DSO-8 P-TO252-5-3 0) Value Unit -50 A -50 -200 256 mJ -6 kV/µs ±20 V 150 W -55…+175 °C 55/175/56 2005-08-16 ...
Page 2
... DSS T =25 ° =- =175 ° =- GSS =-4 DS(on =-50 A DS(on |>2 DS(on)max =- K/W the chip is able to carry 123 A. thJC 2 (one layer, 70 µm thick) copper area for drain page 2 SPD50P03L Values min. typ. max - -1 -0 -10 -100 = -10 -100 - 8.5 12.5 - 5.7 7 Unit K/W V µA nA mΩ ...
Page 3
... Rev. 1.4 Symbol Conditions C iss oss V =- MHz DS C rss t d(on d(off =- =- =- =- - =- =-50 A plateau =25 ° S,pulse = =25 ° =- =| /dt =100 A/µ page 3 SPD50P03L Values Unit min. typ. max. - 4590 6880 pF - 1220 1830 - 1000 1500 - 14 21 139 208 - 104 156 - -14 - -35 -53 - -95 -126 - -3 - -200 - -1 -1. 2005-08-16 ...
Page 4
... DS C parameter limited by on-state resistance Rev. 1.4 2 Drain current I =f 120 160 200 4 Max. transient thermal impedance Z =f(t thJC parameter µs 10 µ 100 µ [V] page 4 SPD50P03L |≥ 120 T [° 0.5 0.2 0.1 0.05 0.02 0.01 single pulse - [s] p 160 200 - 2005-08-16 ...
Page 5
... Typ. transfer characteristics I =f |>2 DS(on)max parameter Rev. 1.4 6 Typ. drain-source on resistance R =f(I DS(on) parameter -2 [V] 8 Typ. forward transconductance g =f 100 25 °C 80 175 ° [V] page 5 SPD50P03L ); T =25 ° -4 120 -I [A] D =25 ° [ -6 -10 V 160 200 60 2005-08-16 ...
Page 6
... GS(th) 2.5 2 1.5 typ. 1 0.5 0 100 140 180 12 Forward characteristics of reverse diode I =f parameter: T 1000 100 Coss [V] page =-250 98%. typ. 2% -60 - 100 T [° °C, typ 175 °C, typ 25 °C, 98% 175 °C, 98% 0 0.5 1 1.5 -V [V] SD SPD50P03L 140 180 2 2.5 2005-08-16 ...
Page 7
... Drain-source breakdown voltage V =f =-250 A BR(DSS -60 - [°C] j Rev. 1.4 14 Typ. gate charge V =f(Q GS gate parameter °C 10 100 °C 8 150 ° 100 1000 0 16 Gate charge waveforms s(th (th) 100 140 180 page 7 SPD50P03L ); I =-50 A pulsed D DD - 100 -Q [nC] gate 120 Q gate 2005-08-16 ...
Page 8
... Package Outline P-TO252-5-3: Outline Footprint Dimensions in mm Rev. 1.4 Packaging Tape page 8 SPD50P03L 2005-08-16 ...
Page 9
... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.4 page 9 SPD50P03L 2005-08-16 ...