BSS84LT1 ON Semiconductor, BSS84LT1 Datasheet - Page 4

MOSFET P-CH 50V 130MA SOT-23

BSS84LT1

Manufacturer Part Number
BSS84LT1
Description
MOSFET P-CH 50V 130MA SOT-23
Manufacturer
ON Semiconductor
Datasheet

Specifications of BSS84LT1

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
10 Ohm @ 100mA, 5V
Drain To Source Voltage (vdss)
50V
Current - Continuous Drain (id) @ 25° C
130mA
Vgs(th) (max) @ Id
2V @ 250µA
Input Capacitance (ciss) @ Vds
30pF @ 5V
Power - Max
225mW
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Gate Charge (qg) @ Vgs
-
Other names
BSS84LT1OSCT

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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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V
D
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
1
G
A
3
L
2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
H
B S
C
0.037
0.95
0.035
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
0.9
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
0.031
K
0.8
http://onsemi.com
SOT−23 (TO−236)
CASE 318−08
BSS84LT1
ISSUE AH
4
J
SCALE 10:1
0.037
0.95
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. 318−03 AND −07 OBSOLETE, NEW STANDARD
0.079
inches
2.0
mm
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
318−08.
STYLE 21:
DIM
G
A
B
C
D
H
J
K
L
S
V
PIN 1. GATE
0.1102
0.0472
0.0350
0.0150
0.0701
0.0005
0.0034
0.0140
0.0350
0.0830
0.0177
2. SOURCE
3. DRAIN
MIN
INCHES
0.0551
0.0440
0.0200
0.0807
0.0040
0.0070
0.0285
0.0401
0.1039
0.0236
0.1197
MAX
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
0.013
0.085
MILLIMETERS
MIN
2.80
1.20
0.89
0.37
1.78
0.35
0.89
2.10
0.45
0.100
0.177
MAX
3.04
1.40
1.11
0.50
2.04
0.69
1.02
2.64
0.60
BSS84LT1/D

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