BSC106N025S G Infineon Technologies, BSC106N025S G Datasheet

MOSFET N-CH 25V 30A TDSON-8

BSC106N025S G

Manufacturer Part Number
BSC106N025S G
Description
MOSFET N-CH 25V 30A TDSON-8
Manufacturer
Infineon Technologies
Series
OptiMOS™r
Datasheet

Specifications of BSC106N025S G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
10.6 mOhm @ 30A, 10V
Drain To Source Voltage (vdss)
25V
Current - Continuous Drain (id) @ 25° C
30A
Vgs(th) (max) @ Id
2V @ 20µA
Gate Charge (qg) @ Vgs
11nC @ 5V
Input Capacitance (ciss) @ Vds
1370pF @ 15V
Power - Max
43W
Mounting Type
Surface Mount
Package / Case
8-PowerTDFN
Configuration
Single Quad Drain Triple Source
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
16.7 Ohms
Drain-source Breakdown Voltage
25 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
30 A
Power Dissipation
2.8 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BSC106N025SGXT
SP000095470
Rev. 1.4
Features
• Fast switching MOSFET for SMPS
• Optimized technology for notebook DC/DC converters
• Qualified according to JEDEC
• Logic level / N-channel
• Excellent gate charge x R
• Very low on-resistance R
• Superior thermal resistance
• Avalanche rated; dv/dt rated
• Pb-free lead plating; RoHS compliant
• Halogen-free according to IEC61249-2-21
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Reverse diode dv /dt
Gate source voltage
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
OptiMOS™2 Power-Transistor
Type
BSC106N025S G
j
Package
PG-TDSON-8
=25 °C, unless otherwise specified
DS(on)
DS(on)
1
for target applications
product (FOM)
Symbol Conditions
I
I
E
dv /dt
V
P
T
D
D,pulse
j
AS
GS
tot
, T
Marking
106N025S
stg
T
T
T
R
T
I
I
di /dt =200 A/µs,
T
T
T
R
D
D
page 1
C
C
A
C
j,max
C
A
thJA
=30 A, R
=30 A, V
thJA
=25 °C,
=25 °C,
=25 °C
=100 °C
=25 °C
=25 °C
=45 K/W
=45 K/W
=150 °C
3)
DS
GS
=24 V,
=25 Ω
2)
2)
Product Summary
V
R
I
D
DS
DS(on),max
-55 ... 150
55/150/56
Value
PG-TDSON-8
120
±20
2.8
30
30
13
80
43
6
BSC106N025S G
10.6
25
30
Unit
A
mJ
kV/µs
V
W
°C
V
mΩ
A
2009-11-03

Related parts for BSC106N025S G

BSC106N025S G Summary of contents

Page 1

... Symbol Conditions I T =25 ° =100 ° =25 ° =45 K/W thJA =25 °C D,pulse C =25 Ω = = = /dt di /dt =200 A/µs, T =150 °C j,max =25 °C tot C T =25 ° =45 K/W thJA stg page 1 BSC106N025S 10.6 mΩ PG-TDSON-8 Value Unit 120 kV/µs ± 2.8 -55 ... 150 °C 55/150/56 2009-11-03 ...

Page 2

... GS(th = DSS T =25 ° = =125 ° = GSS =4 =15 A DS( |>2 DS(on)max = (one layer, 70 µm thick) copper area for drain page 2 BSC106N025S G Values Unit min. typ. max 2.4 K 1.2 1 0.1 1 µ 100 - 10 100 nA - 13.4 16.7 mΩ - 8.8 10.6 Ω 2009-11-03 ...

Page 3

... DD GS =2.7 Ω d(off g( plateau V =0 g(sync = oss =25 ° S,pulse = =25 ° = /dt =400 A/µs F page 3 BSC106N025S G Values Unit min. typ. max. - 1030 1370 pF - 396 527 - 3.9 5 3.8 5 3.0 4.5 - 3.7 4 1.6 2.2 - 2.5 3.8 - 4.6 6 120 - 0.93 1 2009-11-03 ...

Page 4

... V Rev. 1.4 2 Drain current I =f 120 160 0 [° Max. transient thermal impedance Z =f(t thJC p parameter µ µs 100 µ [V] DS page 4 BSC106N025S G ≥ 120 T [° 0.5 0.2 0.1 0.05 0.02 0.01 single pulse - [s] p 160 0 10 2009-11-03 ...

Page 5

... Typ. output characteristics I =f =25 ° parameter 4 Typ. transfer characteristics I =f |>2 DS(on)max parameter 150 ° Rev. 1.4 6 Typ. drain-source on resistance R =f(I DS(on) parameter 3 3 Typ. forward transconductance g =f ° [V] GS page 5 BSC106N025S =25 ° 3 [A] D =25 ° [ 2009-11-03 ...

Page 6

... Typ. gate threshold voltage V =f(T GS(th) parameter: I 2.4 2 1.6 1.2 typ 0.8 0 140 190 -60 [° Forward characteristics of reverse diode I =f parameter Crss [V] DS page 6 BSC106N025S 200 µA 20 µA - 140 T [° °C, 98% 25 °C 150 °C, 98% 150 °C 0 0.5 1 1.5 V [V] SD 190 2 2009-11-03 ...

Page 7

... I =f parameter: T j(start) 100 Drain-source breakdown voltage V =f BR(DSS -60 - Rev. 1.4 14 Typ. gate charge V =f(Q GS parameter °C 8 100 °C 125 ° 100 1000 [µ Gate charge waveforms s(th) Q g(th) 90 140 190 [°C] j page 7 BSC106N025S =25 A pulsed gate [nC] gate ate 2009-11-03 ...

Page 8

... Package Outline P-TDSON-8: Outline Rev. 1.4 PG-TDSON-8 page 8 BSC106N025S G 2009-11-03 ...

Page 9

... Package Outline P-TDSON-8: Tape Dimensions in mm Rev. 1.4 page 9 BSC106N025S G 2009-11-03 ...

Page 10

... Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.4 page 10 BSC106N025S G 2009-11-03 ...

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