MT47H64M8CF-25E:G Micron Technology Inc, MT47H64M8CF-25E:G Datasheet - Page 106

• Manufacturer Part Number: MT47H64M8CF-25E:G
• Description: 64MX8 DDR2 SDRAM PLASTIC PBF FBGA 1.8V
• Manufacturer: Micron Technology Inc
• Series: -r

Specifications of MT47H64M8CF-25E:G

• Format - Memory: RAM
• Memory Type: DDR2 SDRAM
• Memory Size: 512M (64M x 8)
• Speed: 2.5ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 60-TFBGA
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Figure 59: WRITE Interrupted by WRITE
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
DQS, DQS#
Command
Address
CK#
A10
DQ
CK
WRITE 1 a
Valid 5
T0
2-clock requirement
Notes:
NOP 2
T1
WL = 3
1. BL = 8 required and auto precharge must be disabled (A10 = LOW).
2. The NOP or COMMAND INHIBIT commands are valid. The PRECHARGE command cannot
3. The interrupting WRITE command must be issued exactly 2 ×
4. The earliest WRITE-to-PRECHARGE timing for WRITE at T0 is WL + BL/2 +
5. The WRITE command can be issued to any valid bank and row address (WRITE command
6. Auto precharge can be either enabled (A10 = HIGH) or disabled (A10 = LOW) by the in-
7. Subsequent rising DQS signals must align to the clock within
8. Example shown uses AL = 0; CL = 4, BL = 8.
be issued to banks used for WRITEs at T0 and T2.
starts with T7 and not T5 (because BL = 8 from MR and not the truncated length).
at T0 and T2 can be either same bank or different bank).
terrupting WRITE command.
WRITE 3 b
Valid 6
Valid 5
T2
NOP 2
T3
DI
a
WL = 3
a + 1
DI
NOP 2
a + 2
T4
7
DI
106
a + 3
DI
NOP 2
T5
DI
b
7
Micron Technology, Inc. reserves the right to change products or specifications without notice.
b + 1
512Mb: x4, x8, x16 DDR2 SDRAM
DI
NOP 2
b + 2
T6
DI
7
b + 3
DI
Valid 4
b + 4
T7
DI
7
Transitioning Data
© 2004 Micron Technology, Inc. All rights reserved.
t
t
b + 5
DQSS.
CK from previous WRITE.
DI
Valid 4
b + 6
T8
DI
7
b + 7
t
DI
WR where
Valid 4
Don’t Care
T9
WRITE
t
WR